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T今天我们专门找了原装 MCU 开箱展示给大家看，您可以对芯片的工厂封装有更深入的了解，NXP 的 MCU 具有较高的市场份额，应用广泛。如果您购买了这个品牌的 MCU，希望这个视频能为您提供一些有价值的信息。
NXP 解包
• 首先，我们首先通过外箱上的标签贴纸了解这款 NXP 的基本情况。当我们打开盒子时，两面包裹着红色泡沫纸，提供防震保护，防止真空袋被磕碰和泄漏。一些原装和正品 NXP 产品使用这种类型的泡沫纸。
• 除了真空袋上的原始标签外，还有很多关于真空袋上组件保存的信息，非常详细。我们切开真空袋，看看里面的包装。打开后，记得将真空袋密封回去并尽快存放，以防止组件受潮。此外，如果湿度卡不是蓝色的，则表示它是 damp。当圆圈为颜色由蓝色变为粉红色时，表示包装内的湿度达到或超过圆圈对应的相对湿度值。它需要经过烘烤和除湿，然后才能在机器上使用。当真空度好时，它通常不会受潮。包装中的干燥剂可能是因为 MCU 是一个对湿度高度敏感的器件，而烘干机也是相对封装的。还有一个湿度 card.detaile。
![DX5TRSKY]LIV3LN@]DQDYS2.png](/image/ueditor/php/upload/image/20240506/1714979928681754.png "1714979928681754.png")
• When cutting the tape, remember to hold it down with your hands to prevent the tape from springing out too hard and knocking over the chip. There are also tray specifications next to the tray.Even though the chip we are unboxing today is 21 years old, due to proper storage, the pins are still bright in color without any oxidation, and the surface of the chip is smooth and clean, which looks very healing.
• Let's take a look at the silk screen，This material was produced in 21 years，The logo is Freescale，Even the new year is NXP's，These are the original MCUs of Freescale，The silk screen is still Freescale's logo，This is what you need to pay attention to when buying these materials，The second row is the version of the component, and the third row is the batch information，Here is 21 years and 43 weeks.
Can the chip still be used after the NXP chip humidity card changes color?
• After receiving components from suppliers, many people find that the humidity card inside the package has changed color. They will feel very worried. Can the chip still be used after the chip humidity card changes color?
• First of all, the discoloration of the humidity card will not affect the function of the product as long as the components are not oxidized. However, it may be that the vacuum packaging of the components leaked during the logistics process, causing moisture to enter the packaging bags of the components. At this time, you There will be some minor application problems during the welding process of the components. Of course, this can be solved. You only need to bake the components before using the product. Baking the components removes internal and external moisture from the components. When in use, it can reduce the number of component soldering, or the bulges inside the chip due to moisture, etc.
![I6`AR~G[]T6)7RTU]9`ODCE.png](/image/ueditor/php/upload/image/20240506/1714985219250181.png "1714985219250181.png")
