The chip model is usually composed of three modules. The brand series is followed by parameters, as well as temperature, speed and packaging information. The packaging, lead-free information and packaging forms here are collectively called packaging information, and the three modules form a formula that can parse the naming of most chips.We understand the last one (temperature, speed, packaging) as one part, because some brands may end with all three or only one of them, so here we assume it is a variable state. Don't think it's a bit complicated, just take a real case and you'll understand. Take this NXP model, MC is the prefix of Freescale (acquired by NXP), and 9S08AC is the family series of the product (Freescale's series) It corresponds to our first brand series, and its middle segment 60 represents 60KB of memory, parameter c represents temperature, FG represents package, and E represents lead-free. It corresponds to the third part, it’s not difficult, right?
