Page 26_Integrated Circuits (ICs)_Full Half-Bridge Drivers-ICONE-chip,IntegrationCircuit , Semiconductor Distributors, IC Chips
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Full Half-Bridge Drivers

Alarms, Buzzers, and Sirens

Results: 1352
Filters
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Manufacturer

  • Allegro MicroSystems
  • Ampleon USA Inc.
  • Analog Devices Inc.
  • Analog Devices Inc./Maxim Integrated
  • Asahi Kasei Microdevices/AKM
  • Cypress Semiconductor Corp
  • EPC
  • Fairchild Semiconductor
  • Freescale Semiconductor
  • Harris Corporation
  • Infineon Technologies
  • Intel
  • International Rectifier
  • Intersil
  • Microchip Technology
  • Monolithic Power Systems Inc.
  • National Semiconductor
  • Nisshinbo Micro Devices Inc.
  • NXP USA Inc.
  • onsemi
  • Panasonic Electric Works
  • Panasonic Electronic Components
  • Power Integrations
  • Powerex Inc.
  • Renesas Electronics America Inc
  • Rohm Semiconductor
  • Sanken
  • Sanyo
  • Semtech Corporation
  • Skyworks Solutions Inc.
  • SparkFun Electronics
  • STMicroelectronics
  • Texas Instruments
  • Toshiba Semiconductor and Storage
  • Unitrode
  • Vishay Siliconix
  • Wise-Integration

Series

  • *
  • -
  • ASPM™
  • ASPM™, FastSwitch™
  • Automotive, AEC-Q100
  • Automotive, AEC-Q100, MPQ
  • BridgeSwitch
  • CoolGaN™
  • CoreControl™
  • EiceDriver™
  • ePower™
  • HiperLCS™
  • Intelli-Phase™
  • IRSM505-015
  • IRSM505-065
  • IRSM515-025
  • IRSM515-055
  • IRSM515-084
  • LM18298
  • MOTIX™
  • MP
  • NexFET™
  • NovalithIC™
  • OMNIFET III™, VIPower™
  • OMNIFET II™, VIPower™
  • PowerTrench®
  • PowerTrench®, SyncFET™
  • PowIRstage®
  • STSPIN2
  • TrilithIC
  • TrilithIC™
  • VIPower™
  • VRPower®
  • WiseGan™
  • XS™ DrMOS
  • µIPM™
  • µIPM™-DIP

Package

  • -
  • Box
  • Bulk
  • Cut Tape (CT)
  • Tape & Box (TB)
  • Tape & Reel (TR)
  • Tape & Reel (TR)
  • Tray
  • Tube

Product Status

  • Active
  • Discontinued at /
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Operating Temperature

  • -
  • -10°C ~ 100°C
  • -10°C ~ 70°C (TA)
  • -20°C ~ 100°C (TA)
  • -20°C ~ 100°C (TJ)
  • -20°C ~ 125°C (TJ)
  • -20°C ~ 150°C (TJ)
  • -20°C ~ 60°C (TA)
  • -20°C ~ 70°C (TA)
  • -20°C ~ 75°C (TA)
  • -20°C ~ 80°C (TA)
  • -20°C ~ 85°C (TA)
  • -20°C ~ 90°C (TA)
  • -25°C ~ 125°C (TJ)
  • -25°C ~ 150°C (TJ)
  • -25°C ~ 75°C (TA)
  • -30°C ~ 100°C (TA)
  • -30°C ~ 110°C (TA)
  • -30°C ~ 150°C (TJ)
  • -30°C ~ 75°C (TA)
  • -30°C ~ 80°C (TA)
  • -30°C ~ 85°C
  • -30°C ~ 85°C (TA)
  • -30°C ~ 90°C (TA)
  • -30°C ~ 95°C (TA)
  • -35°C ~ 85°C (TA)
  • -40°C ~ 100°C (TA)
  • -40°C ~ 105°C
  • -40°C ~ 105°C (TA)
  • -40°C ~ 105°C (TJ)
  • -40°C ~ 110°C (TJ)
  • -40°C ~ 125°C
  • -40°C ~ 125°C (TA)
  • -40°C ~ 125°C (TJ)
  • -40°C ~ 140°C (TJ)
  • -40°C ~ 150°C
  • -40°C ~ 150°C (TA)
  • -40°C ~ 150°C (TJ)
  • -40°C ~ 165°C (TJ)
  • -40°C ~ 170°C (TJ)
  • -40°C ~ 175°C (TJ)
  • -40°C ~ 85°C
  • -40°C ~ 85°C (TA)
  • -40°C ~ 85°C (TJ)
  • -40°C ~ 90°C (TA)
  • -40°C ~ 95°C (TA)
  • -55°C ~ 125°C (TJ)
  • -55°C ~ 150°C
  • -55°C ~ 150°C (TA)
  • -55°C ~ 150°C (TJ)
  • -55°C ~ 175°C (TJ)
  • 0°C ~ 125°C (TJ)
  • 0°C ~ 150°C (TJ)
  • 0°C ~ 70°C
  • 150°C (TJ)
  • 165°C (TJ)
  • 175°C (TJ)

Mounting Type

  • -
  • Surface Mount
  • Surface Mount, Wettable Flank
  • Through Hole
  • 1352 Results
  • Img
    Pdf
    Part Number
    Manufacturers
    Desc
    In Stock
    Packing
    Rfq
    SIC654CD-T1-GE3
    270
    PowerPAK® MLP55-31L
    CSD97396Q4MT
    32
    8-PowerVFDFN
    SIC531CD-T1-GE3
    528
    PowerPAK® MLP4535-22L
    EPC23102ENGRT
    3375
    13-PowerWFQFN
    STK5C4U332J-E
    46
    38-SDIP Module, 24 Leads, Formed
    STK5Q4U352J-E
    35
    Module
    SIC632ACD-T1-GE3
    758
    PowerPAK® MLP55-31L
    MGD3160AM335EK
    79
    32-BSSOP (0.295", 7.50mm Width)
    LV8068V-TLM-H
    760
    SIC641CD-T1-GE3
    3
    PowerPAK® MLP55-31L
    SIC781CD-T1-GE3
    75
    PowerPAK® MLP66-40
    STSPIN230
    500
    16-VFQFN Exposed Pad
    MP6610GS-P
    475
    8-SOIC (0.154", 3.90mm Width)
    BD6222FP-E2
    35
    25-SOP (0.213", 5.40mm Width) + 2 Heat Tabs
    FDMF5821DC
    87
    31-PowerWFQFN
    CSD95372BQ5M
    50
    12-PowerLFDFN
    SIC652CD-T1-GE3
    36
    PowerPAK® MLP55-31L
    BS2130F-GE2
    29
    28-SOIC (0.295", 7.50mm Width)
    FDMF5822DC
    3
    31-PowerWFQFN
    MP86957GMJ-P
    52
    41-PowerVFLGA
    L6206PD
    9176
    36-BSSOP (0.433", 11.00mm Width) Exposed Pad
    L6202
    7598
    18-DIP (0.300", 7.62mm)
    L298P013TR
    1559
    20-SOIC (0.433", 11.00mm Width) Exposed Pad
    L6201PSTR
    40
    20-SOIC (0.295", 7.50mm Width)
    L6206PD013TR
    3006
    36-BSSOP (0.433", 11.00mm Width) Exposed Pad
    NCV7723DQBR2G
    23
    24-LSSOP (0.154", 3.90mm Width) Exposed Pad
    HIP4081AIBZT
    7070
    20-SOIC (0.295", 7.50mm Width)
    L6206D013TR
    2941
    24-SOIC (0.295", 7.50mm Width)
    ISL55111IRZ
    6686
    16-TFQFN Exposed Pad
    HIP4020IBZ
    2
    20-SOIC (0.295", 7.50mm Width)

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