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IC CPLD 192MC 7.5NS 100MBGA
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7834
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100-TFBGA
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Linear Voltage Regulator IC Positive Adjustable 1 Output 1A 10-DFN (3x3)
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3533
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10-VFDFN Exposed Pad
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA
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6505
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1152-BBGA, FCBGA
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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 165 516096 15408 256-LBGA Operating Conditions When Cyclone IV devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Cyclone IV devices, you must consider the operating requirements described in this chapter. Cyclone IV devices are offered in commercial, industrial, extended industrial and, automotive grades. Cyclone IV E devices offer –6 (fastest), –7, –8, –8L, and –9L speed grades for commercial devices, –8L speed grades for industrial devices, and –7 speed grade for extended industrial and automotive devices. Cyclone IV GX devices offer –6 (fastest), –7, and –8 speed grades for commercial devices and –7 speed grade for industrial devices. Cyclone IV E devices are offered in core voltages of 1.0 and 1.2 V. Cyclone IV E devices with a core voltage of 1.0 V have an ‘L’ prefix attached to the speed grade. In this chapter, a prefix associated with the operating temperature range is attached to the speed grades; commercial with a “C” prefix, industrial with an “I” prefix, and automotive with an “A” prefix. Therefore, commercial devices are indicated as C6, C7, C8, C8L, or C9L per respective speed grade. Industrial devices are indicated as I7, I8, or I8L. Automotive devices are indicated as A7. Cyclone IV E industrial devices I7 are offered with extended operating temperature range. Chip Altera Cyclone naming rules,Chinese chip Will replace it |
3524
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256-LBGA
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IC CPLD 440MC 9NS 256FBGA
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3672
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256-LBGA
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Arria V GX Field Programmable Gate Array (FPGA) IC 544 13284352 190000 1152-BBGA, FCBGA Exposed Pad
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2437
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1152-BBGA, FCBGA Exposed Pad
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Arria V GX Field Programmable Gate Array (FPGA) IC 544 2975744 504140 1152-BBGA, FCBGA
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9764
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1152-BBGA, FCBGA
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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LFBGA Operating Conditions When Cyclone IV devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Cyclone IV devices, you must consider the operating requirements described in this chapter. Cyclone IV devices are offered in commercial, industrial, extended industrial and, automotive grades. Cyclone IV E devices offer –6 (fastest), –7, –8, –8L, and –9L speed grades for commercial devices, –8L speed grades for industrial devices, and –7 speed grade for extended industrial and automotive devices. Cyclone IV GX devices offer –6 (fastest), –7, and –8 speed grades for commercial devices and –7 speed grade for industrial devices. Cyclone IV E devices are offered in core voltages of 1.0 and 1.2 V. Cyclone IV E devices with a core voltage of 1.0 V have an ‘L’ prefix attached to the speed grade. In this chapter, a prefix associated with the operating temperature range is attached to the speed grades; commercial with a “C” prefix, industrial with an “I” prefix, and automotive with an “A” prefix. Therefore, commercial devices are indicated as C6, C7, C8, C8L, or C9L per respective speed grade. Industrial devices are indicated as I7, I8, or I8L. Automotive devices are indicated as A7. Cyclone IV E industrial devices I7 are offered with extended operating temperature range. |
8108
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256-LFBGA
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IC CPLD 1700MC 7NS 324FBGA
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3932
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324-LBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA
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8346
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1152-BBGA, FCBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 51200000 622000 1932-BBGA, FCBGA
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3529
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1932-BBGA, FCBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 72 774144 21280 169-LBGA Introduction The CycloneTM field programmable gate array family is based ona 1.5-V, 0.13-um, alayer copper SRAM process, with densities up to 20,060 logic elements (LEs) and up to 288 Kbits of RAM. With features like phase- locked loops (PLLs) for clocking and a dedicated double data rate (DDR) interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory requirements, Cyclone devices are a cost effective solution for data-path applications. Cyclone devices support various I/O standards, including LVDS at data rates up to 311 megabits per second (Mbps) and 66-MHz, 32-bit peripheral component interconnect (PCI), for interfacing with and supporting ASSP and ASIC devices. Altera also offers new low-cost serial configuration devices to configure Cyclone devices. Features ■Up to 294,912 RAM bits (36,864 bytes) ■Supports configuration through low-cost serial configuration device ■Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards ■Support for 66-MHz, 32-bit PCI standard ■Low speed (311 Mbps) LVDS 1/O support ■Up to two PLLs per device provide clock multiplication and phase shifting ■Up to eight global clock lines with six clock resources available per logic array block (LAB) row ■Support for external memory, induding DDR SDRAM (133 MHz), FCRAM, and single data rate (SDR) SDRAM ■Support for multiple intellectual property (IP) cores, including Altera" MegaCore functions and Altera Megafunctions Partners Program (AMPPSM) megafunctions Chip Altera Cyclone naming rules,Chinese chip Will replace it |
2032
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169-LBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA
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7878
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324-LBGA
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Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Arria 10 SX FPGA - 660K Logic Elements 1.5GHz 1152-FBGA, FC (35x35)
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9635
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1152-BBGA, FCBGA
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Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 39936000 457000 1517-BBGA, FCBGA
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2576
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1517-BBGA, FCBGA
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Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 2002944 25000 256-LBGA Summary of Features for Cyclone V Devices Technology • TSMC's 28-nm low-power (28LP) process technology • 1.1 V core voltage Packaging • Wirebond low-halogen packages • Multiple device densities with compatible package footprints for seamless migration between different device densities • RoHS-compliant and leaded(1)options High-performance FPGA fabric Enhanced 8-input ALM with four registers Internal memory blocks • M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC) • Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory Embedded Hard IP blocks Variable-precision DSP • Native support for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same variable-precision DSP block • 64-bit accumulator and cascade • Embedded internal coefficient memory • Preadder/subtractor for improved efficiency Memory controller DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support Embedded transceiver I/O PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with multifunction support, endpoint, and root port Clock networks • Up to 550 MHz global clock network • Global, quadrant, and peripheral clock networks • Clock networks that are not used can be powered down to reduce dynamic power Phase-locked loops (PLLs) • Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB) • Integer mode and fractional mode FPGA General-purpose I/Os (GPIOs) • 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter • 400 MHz/800 Mbps external memory interface • On-chip termination (OCT) • 3.3 V support with up to 16 mA drive strength Low-power high-speed serial interface • 614 Mbps to 6.144 Gbps integrated transceiver speed • Transmit pre-emphasis and receiver equalization • Dynamic partial reconfiguration of individual channels HPS(Cyclone V SE, SX,and ST devices only) • Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with support for symmetric and asymmetric multiprocessing • Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0 On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO interfaces • System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers • On-chip RAM and boot ROM • HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa • FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport front end (MPFE) of the HPS SDRAM controller • Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage Configuration • Tamper protection—comprehensive design protection to protect your valuable IP investments • Enhanced advanced encryption standard (AES) design security features • CvP • Dynamic reconfiguration of the FPGA • Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and x16 configuration options • Internal scrubbing (2) • Partial reconfiguration (3) How to choose FPGA for your project?
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3105
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256-LBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 1105920 29440 324-LBGA
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9104
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324-LBGA
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Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA
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1595
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1152-BBGA, FCBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 51200000 622000 1517-BBGA, FCBGA
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6339
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1517-BBGA, FCBGA
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Cyclone® 10 LP Field Programmable Gate Array (FPGA) IC 176 423936 10320 256-LFBGA Description This document describes the electrical and switching characteristics for Intel® Cyclone® 10 LP devices as well as I/O timing, including programmable I/O element (IOE) delay and programmable output buffer delay Operating Conditions When Intel Cyclone 10 LP devices are implemented in a system, they are rated according to a set of defined parameters. To maintain the highest possible performance and reliability of Intel Cyclone 10 LP devices, you must consider the operating requirements described in this document. Intel Cyclone 10 LP devices are offered in commercial, industrial, extended industrial and, automotive grades as follows: • –6 (fastest) and –8 speed grades for commercial devices • –7 and –8 speed grades for industrial devices • –7 speed grade for automotive devices Intel Cyclone 10 LP devices are offered in the following core voltages: • Lower core voltage option (1.0 V)—"Z": For –I8 speed grade • Standard core voltage option (1.2 V)—"Y": For –C6, –C8, –I7, and –A7 speed grades A prefix associated with the operating temperature range is attached to the speed grades: • Commercial with a "C" prefix: –C6, –C8 • Industrial with an "I" prefix: –I7, –I8 • Automotive with an "A" prefix: –A7 PDF |
4012
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256-LFBGA
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 2562048 49888 484-BGA
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9093
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484-BGA
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MAX® 10 Field Programmable Gate Array (FPGA) IC 178 193536 4000 256-LBGA
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2425
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256-LBGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA
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1716
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1152-BBGA, FCBGA
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MAX® 10 Field Programmable Gate Array (FPGA) IC 101 193536 4000 144-LQFP Exposed Pad Intel® MAX® 10 FPGA Device Overview Intel® MAX® 10 devices are single-chip, non-volatile low-cost programmable logic devices (PLDs) to integrate the optimal set of system components. The highlights of the Intel MAX 10 devices include: • Internally stored dual configuration flash • User flash memory • Instant on support • Integrated analog-to-digital converters (ADCs) • Single-chip Nios II soft core processor support Intel MAX 10 devices are the ideal solution for system management, I/O expansion, communication control planes, industrial, automotive, and consumer applications. Supporting Feature Secure on-die flash memory enables device configuration in less than 10 ms • Single device integrating PLD logic, RAM, flash memory, digital signal processing (DSP), ADC, phase-locked loop (PLL), and I/Os • Small packages available from 3 mm × 3 mm • Sleep mode—significant standby power reduction and resumption in less than 1 ms • Longer battery life—resumption from full power-off in less than 10 ms Built on TSMC's 55 nm embedded flash process technology • Intel Quartus® Prime Lite edition (no cost license) • Platform Designer (Standard) system integration tool • DSP Builder for Intel FPGAs • Nios® II Embedded Design Suite (EDS) How to choose FPGA for your project? |
3488
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144-LQFP Exposed Pad
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Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 310 4257792 73920 672-BGA
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3694
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672-BGA
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MAX® 10 Field Programmable Gate Array (FPGA) IC 101 387072 8000 144-LQFP Exposed Pad
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2731
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144-LQFP Exposed Pad
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 51200000 622000 1152-BBGA, FCBGA
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6332
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1152-BBGA, FCBGA
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Cyclone® V GT Field Programmable Gate Array (FPGA) IC 240 5001216 77000 484-BGA Summary of Features for Cyclone V Devices Technology • TSMC's 28-nm low-power (28LP) process technology • 1.1 V core voltage Packaging • Wirebond low-halogen packages • Multiple device densities with compatible package footprints for seamless migration between different device densities • RoHS-compliant and leaded(1)options High-performance FPGA fabric Enhanced 8-input ALM with four registers Internal memory blocks • M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC) • Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25% of the ALMs as MLAB memory Embedded Hard IP blocks Variable-precision DSP • Native support for up to three signal processing precision levels (three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same variable-precision DSP block • 64-bit accumulator and cascade • Embedded internal coefficient memory • Preadder/subtractor for improved efficiency Memory controller DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support Embedded transceiver I/O PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with multifunction support, endpoint, and root port Clock networks • Up to 550 MHz global clock network • Global, quadrant, and peripheral clock networks • Clock networks that are not used can be powered down to reduce dynamic power Phase-locked loops (PLLs) • Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB) • Integer mode and fractional mode FPGA General-purpose I/Os (GPIOs) • 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter • 400 MHz/800 Mbps external memory interface • On-chip termination (OCT) • 3.3 V support with up to 16 mA drive strength Low-power high-speed serial interface • 614 Mbps to 6.144 Gbps integrated transceiver speed • Transmit pre-emphasis and receiver equalization • Dynamic partial reconfiguration of individual channels HPS(Cyclone V SE, SX,and ST devices only) • Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with support for symmetric and asymmetric multiprocessing • Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0 On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO interfaces • System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA) controller, FPGA configuration manager, and clock and reset managers • On-chip RAM and boot ROM • HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa • FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport front end (MPFE) of the HPS SDRAM controller • Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage Configuration • Tamper protection—comprehensive design protection to protect your valuable IP investments • Enhanced advanced encryption standard (AES) design security features • CvP • Dynamic reconfiguration of the FPGA • Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and x16 configuration options • Internal scrubbing (2) • Partial reconfiguration (3) |
8904
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484-BGA
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Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA
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7221
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1517-BBGA, FCBGA
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Arria 10 GX Field Programmable Gate Array (FPGA) IC 504 68857856 1150000 1152-BBGA, FCBGA
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7360
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1152-BBGA, FCBGA
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