Intel

Cyclone® III Field Programmable Gate Array (FPGA) IC 346 516096 15408 484-BGA

Cyclone III Device Family Overview

Cyclone® III device family offers a unique combination of high functionality, low

power and low cost. Based on Taiwan Semiconductor Manufacturing Company

(TSMC) low-power (LP) process technology, silicon optimizations and software

features to minimize power consumption, Cyclone III device family provides the ideal

solution for your high-volume, low-power, and cost-sensitive applications. To address

the unique design needs, Cyclone III device family offers the following two variants:

■ Cyclone III—lowest power, high functionality with the lowest cost

■ Cyclone III LS—lowest power FPGAs with security

With densities ranging from about 5,000 to 200,000 logic elements (LEs) and

0.5 Megabits (Mb) to 8 Mb of memory for less than ¼ watt of static power

consumption, Cyclone III device family makes it easier for you to meet your power

budget. Cyclone III LS devices are the first to implement a suite of security features at

the silicon, software, and intellectual property (IP) level on a low-power and

high-functionality FPGA platform. This suite of security features protects the IP from

tampering, reverse engineering and cloning. In addition, Cyclone III LS devices

support design separation which enables you to introduce redundancy in a single

chip to reduce size, weight, and power of your application.

Cyclone III Device Family Features

Cyclone III device family offers the following features:

Lowest Power FPGAs

■ Lowest power consumption with TSMC low-power process technology and

Altera® power-aware design flow

■ Low-power operation offers the following benefits:

■ Extended battery life for portable and handheld applications

■ Reduced or eliminated cooling system costs

■ Operation in thermally-challenged environments

■ Hot-socketing operation support

Design Security Feature

Cyclone III LS devices offer the following design security features:

■ Configuration security using advanced encryption standard (AES) with 256-bit

volatile key

■ Routing architecture optimized for design separation flow with the Quartus® II

software

■ Design separation flow achieves both physical and functional isolation

between design partitions

■ Ability to disable external JTAG port

■ Error Detection (ED) Cycle Indicator to core

■ Provides a pass or fail indicator at every ED cycle

■ Provides visibility over intentional or unintentional change of configuration

random access memory (CRAM) bits

■ Ability to perform zeroization to clear contents of the FPGA logic, CRAM,

embedded memory, and AES key

■ Internal oscillator enables system monitor and health check capabilities

Chip Altera Cyclone naming rules，Chinese chip Will replace it

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Cyclone® IV E Field Programmable Gate Array (FPGA) IC 79 608256 22320 144-LQFP Exposed Pad

Operating Conditions

When Cyclone IV devices are implemented in a system, they are rated according to a

set of defined parameters. To maintain the highest possible performance and

reliability of Cyclone IV devices, you must consider the operating requirements

described in this chapter.

Cyclone IV devices are offered in commercial, industrial, extended industrial and,

automotive grades. Cyclone IV E devices offer –6 (fastest), –7, –8, –8L, and –9L speed

grades for commercial devices, –8L speed grades for industrial devices, and –7 speed

grade for extended industrial and automotive devices. Cyclone IV GX devices offer

–6 (fastest), –7, and –8 speed grades for commercial devices and –7 speed grade for

industrial devices.

Cyclone IV E devices are offered in core voltages of 1.0 and 1.2 V. Cyclone IV E

devices with a core voltage of 1.0 V have an ‘L’ prefix attached to the speed grade.

In this chapter, a prefix associated with the operating temperature range is attached to

the speed grades; commercial with a “C” prefix, industrial with an “I” prefix, and

automotive with an “A” prefix. Therefore, commercial devices are indicated as C6, C7,

C8, C8L, or C9L per respective speed grade. Industrial devices are indicated as I7, I8,

or I8L. Automotive devices are indicated as A7.

Cyclone IV E industrial devices I7 are offered with extended operating temperature range.

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® IV E Field Programmable Gate Array (FPGA) IC 343 516096 15408 484-BGA

Operating Conditions

When Cyclone IV devices are implemented in a system, they are rated according to a

set of defined parameters. To maintain the highest possible performance and

reliability of Cyclone IV devices, you must consider the operating requirements

described in this chapter.

Cyclone IV devices are offered in commercial, industrial, extended industrial and,

automotive grades. Cyclone IV E devices offer –6 (fastest), –7, –8, –8L, and –9L speed

grades for commercial devices, –8L speed grades for industrial devices, and –7 speed

grade for extended industrial and automotive devices. Cyclone IV GX devices offer

–6 (fastest), –7, and –8 speed grades for commercial devices and –7 speed grade for

industrial devices.

Cyclone IV E devices are offered in core voltages of 1.0 and 1.2 V. Cyclone IV E

devices with a core voltage of 1.0 V have an ‘L’ prefix attached to the speed grade.

In this chapter, a prefix associated with the operating temperature range is attached to

the speed grades; commercial with a “C” prefix, industrial with an “I” prefix, and

automotive with an “A” prefix. Therefore, commercial devices are indicated as C6, C7,

C8, C8L, or C9L per respective speed grade. Industrial devices are indicated as I7, I8,

or I8L. Automotive devices are indicated as A7.

Cyclone IV E industrial devices I7 are offered with extended operating temperature range.

Chip Altera Cyclone naming rules，Chinese chip Will replace it

PDF

Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 150 774144 21280 324-LBGA

Introduction

The CycloneTM field programmable gate array family is based ona 1.5-V,

0.13-um, alayer copper SRAM process, with densities up to 20,060 logic

elements (LEs) and up to 288 Kbits of RAM. With features like phase-

locked loops (PLLs) for clocking and a dedicated double data rate (DDR)

interface to meet DDR SDRAM and fast cycle RAM (FCRAM) memory

requirements, Cyclone devices are a cost effective solution for data-path

applications. Cyclone devices support various I/O standards, including

LVDS at data rates up to 311 megabits per second (Mbps) and 66-MHz,

32-bit peripheral component interconnect (PCI), for interfacing with and

supporting ASSP and ASIC devices. Altera also offers new low-cost serial

configuration devices to configure Cyclone devices.

Features

■Up to 294,912 RAM bits (36,864 bytes)

■Supports configuration through low-cost serial configuration device

■Support for LVTTL, LVCMOS, SSTL-2, and SSTL-3 I/O standards

■Support for 66-MHz, 32-bit PCI standard

■Low speed (311 Mbps) LVDS 1/O support

■Up to two PLLs per device provide clock multiplication and phase shifting

■Up to eight global clock lines with six clock resources available per

logic array block (LAB) row

■Support for external memory, induding DDR SDRAM (133 MHz),

FCRAM, and single data rate (SDR) SDRAM

■Support for multiple intellectual property (IP) cores, including

Altera" MegaCore functions and Altera Megafunctions Partners

Program (AMPPSM) megafunctions

Chip Altera Cyclone naming rules，Chinese chip Will replace it

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Cyclone® V E Field Programmable Gate Array (FPGA) IC 128 2002944 25000 256-LBGA

Summary of Features for Cyclone V Devices

Technology

• TSMC's 28-nm low-power (28LP) process technology

• 1.1 V core voltage

Packaging

• Wirebond low-halogen packages

• Multiple device densities with compatible package footprints for seamless migration between

different device densities

• RoHS-compliant and leaded(1)options

High-performance FPGA fabric

Enhanced 8-input ALM with four registers

Internal memory blocks

• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)

• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%

of the ALMs as MLAB memory

Embedded Hard IP blocks

Variable-precision DSP

• Native support for up to three signal processing precision levels

(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same

variable-precision DSP block

• 64-bit accumulator and cascade

• Embedded internal coefficient memory

• Preadder/subtractor for improved efficiency

Memory controller

DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support

Embedded transceiver I/O

PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with

multifunction support, endpoint, and root port

Clock networks

• Up to 550 MHz global clock network

• Global, quadrant, and peripheral clock networks

• Clock networks that are not used can be powered down to reduce dynamic power

Phase-locked loops (PLLs)

• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

• Integer mode and fractional mode

FPGA General-purpose I/Os (GPIOs)

• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter

• 400 MHz/800 Mbps external memory interface

• On-chip termination (OCT)

• 3.3 V support with up to 16 mA drive strength

Low-power high-speed serial interface

• 614 Mbps to 6.144 Gbps integrated transceiver speed

• Transmit pre-emphasis and receiver equalization

• Dynamic partial reconfiguration of individual channels

HPS(Cyclone V SE, SX,and ST devices only)

• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with

support for symmetric and asymmetric multiprocessing

• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0

On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND

flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area

network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO

interfaces

• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)

controller, FPGA configuration manager, and clock and reset managers

• On-chip RAM and boot ROM

• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA

bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa

• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport

front end (MPFE) of the HPS SDRAM controller

• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced advanced encryption standard (AES) design security features

• CvP

• Dynamic reconfiguration of the FPGA

• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and

x16 configuration options

• Internal scrubbing (2)

• Partial reconfiguration (3)

How to choose FPGA for your project?

PDF

Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Summary of Features for Cyclone V Devices

Technology

• TSMC's 28-nm low-power (28LP) process technology

• 1.1 V core voltage

Packaging

• Wirebond low-halogen packages

• Multiple device densities with compatible package footprints for seamless migration between

different device densities

• RoHS-compliant and leaded(1)options

High-performance FPGA fabric

Enhanced 8-input ALM with four registers

Internal memory blocks

• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)

• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%

of the ALMs as MLAB memory

Embedded Hard IP blocks

Variable-precision DSP

• Native support for up to three signal processing precision levels

(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same

variable-precision DSP block

• 64-bit accumulator and cascade

• Embedded internal coefficient memory

• Preadder/subtractor for improved efficiency

Memory controller

DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support

Embedded transceiver I/O

PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with

multifunction support, endpoint, and root port

Clock networks

• Up to 550 MHz global clock network

• Global, quadrant, and peripheral clock networks

• Clock networks that are not used can be powered down to reduce dynamic power

Phase-locked loops (PLLs)

• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

• Integer mode and fractional mode

FPGA General-purpose I/Os (GPIOs)

• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter

• 400 MHz/800 Mbps external memory interface

• On-chip termination (OCT)

• 3.3 V support with up to 16 mA drive strength

Low-power high-speed serial interface

• 614 Mbps to 6.144 Gbps integrated transceiver speed

• Transmit pre-emphasis and receiver equalization

• Dynamic partial reconfiguration of individual channels

HPS(Cyclone V SE, SX,and ST devices only)

• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with

support for symmetric and asymmetric multiprocessing

• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0

On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND

flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area

network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO

interfaces

• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)

controller, FPGA configuration manager, and clock and reset managers

• On-chip RAM and boot ROM

• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA

bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa

• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport

front end (MPFE) of the HPS SDRAM controller

• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced advanced encryption standard (AES) design security features

• CvP

• Dynamic reconfiguration of the FPGA

• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and

x16 configuration options

• Internal scrubbing (2)

• Partial reconfiguration (3)

MAX® 10 Field Programmable Gate Array (FPGA) IC 130 193536 4000 169-LFBGA

Intel® MAX® 10 FPGA Device Overview

Intel® MAX® 10 devices are single-chip, non-volatile low-cost programmable logic

devices (PLDs) to integrate the optimal set of system components.

The highlights of the Intel MAX 10 devices include:

• Internally stored dual configuration flash

• User flash memory

• Instant on support

• Integrated analog-to-digital converters (ADCs)

• Single-chip Nios II soft core processor support

Intel MAX 10 devices are the ideal solution for system management, I/O expansion,

communication control planes, industrial, automotive, and consumer applications.

Supporting Feature

Secure on-die flash memory enables device configuration in less than 10 ms

• Single device integrating PLD logic, RAM, flash memory, digital signal processing (DSP), ADC, phase-locked loop (PLL), and I/Os

• Small packages available from 3 mm × 3 mm

• Sleep mode—significant standby power reduction and resumption in less than 1 ms

• Longer battery life—resumption from full power-off in less than 10 ms

Built on TSMC's 55 nm embedded flash process technology

• Intel Quartus® Prime Lite edition (no cost license)

• Platform Designer (Standard) system integration tool

• DSP Builder for Intel FPGAs

• Nios® II Embedded Design Suite (EDS)

How to choose FPGA for your project?