Intel

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Summary of Features for Cyclone V Devices

Technology

• TSMC's 28-nm low-power (28LP) process technology

• 1.1 V core voltage

Packaging

• Wirebond low-halogen packages

• Multiple device densities with compatible package footprints for seamless migration between

different device densities

• RoHS-compliant and leaded(1)options

High-performance FPGA fabric

Enhanced 8-input ALM with four registers

Internal memory blocks

• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)

• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%

of the ALMs as MLAB memory

Embedded Hard IP blocks

Variable-precision DSP

• Native support for up to three signal processing precision levels

(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same

variable-precision DSP block

• 64-bit accumulator and cascade

• Embedded internal coefficient memory

• Preadder/subtractor for improved efficiency

Memory controller

DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support

Embedded transceiver I/O

PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with

multifunction support, endpoint, and root port

Clock networks

• Up to 550 MHz global clock network

• Global, quadrant, and peripheral clock networks

• Clock networks that are not used can be powered down to reduce dynamic power

Phase-locked loops (PLLs)

• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

• Integer mode and fractional mode

FPGA General-purpose I/Os (GPIOs)

• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter

• 400 MHz/800 Mbps external memory interface

• On-chip termination (OCT)

• 3.3 V support with up to 16 mA drive strength

Low-power high-speed serial interface

• 614 Mbps to 6.144 Gbps integrated transceiver speed

• Transmit pre-emphasis and receiver equalization

• Dynamic partial reconfiguration of individual channels

HPS(Cyclone V SE, SX,and ST devices only)

• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with

support for symmetric and asymmetric multiprocessing

• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0

On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND

flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area

network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO

interfaces

• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)

controller, FPGA configuration manager, and clock and reset managers

• On-chip RAM and boot ROM

• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA

bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa

• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport

front end (MPFE) of the HPS SDRAM controller

• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced advanced encryption standard (AES) design security features

• CvP

• Dynamic reconfiguration of the FPGA

• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and

x16 configuration options

• Internal scrubbing (2)

• Partial reconfiguration (3)

Single ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 25K Logic Elements 600MHz 672-UBGA (23x23)

Summary of Features for Cyclone V Devices

Technology

• TSMC's 28-nm low-power (28LP) process technology

• 1.1 V core voltage

Packaging

• Wirebond low-halogen packages

• Multiple device densities with compatible package footprints for seamless migration between

different device densities

• RoHS-compliant and leaded(1)options

High-performance FPGA fabric

Enhanced 8-input ALM with four registers

Internal memory blocks

• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)

• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%

of the ALMs as MLAB memory

Embedded Hard IP blocks

Variable-precision DSP

• Native support for up to three signal processing precision levels

(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same

variable-precision DSP block

• 64-bit accumulator and cascade

• Embedded internal coefficient memory

• Preadder/subtractor for improved efficiency

Memory controller

DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support

Embedded transceiver I/O

PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with

multifunction support, endpoint, and root port

Clock networks

• Up to 550 MHz global clock network

• Global, quadrant, and peripheral clock networks

• Clock networks that are not used can be powered down to reduce dynamic power

Phase-locked loops (PLLs)

• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

• Integer mode and fractional mode

FPGA General-purpose I/Os (GPIOs)

• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter

• 400 MHz/800 Mbps external memory interface

• On-chip termination (OCT)

• 3.3 V support with up to 16 mA drive strength

Low-power high-speed serial interface

• 614 Mbps to 6.144 Gbps integrated transceiver speed

• Transmit pre-emphasis and receiver equalization

• Dynamic partial reconfiguration of individual channels

HPS(Cyclone V SE, SX,and ST devices only)

• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with

support for symmetric and asymmetric multiprocessing

• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0

On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND

flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area

network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO

interfaces

• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)

controller, FPGA configuration manager, and clock and reset managers

• On-chip RAM and boot ROM

• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA

bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa

• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport

front end (MPFE) of the HPS SDRAM controller

• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced advanced encryption standard (AES) design security features

• CvP

• Dynamic reconfiguration of the FPGA

• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and

x16 configuration options

• Internal scrubbing (2)

• Partial reconfiguration (3)

MAX® 10 Field Programmable Gate Array (FPGA) IC 178 562176 16000 256-LBGA

Inte® MAX®10 FPGA Device Overview

Intel®MAX®10 devices are single-chip, non-volatile low-cost programmable logic

devices (PLDs) to integrate the optimal set of system components.

The highlights of the Intel MAX 10 devices include:

• Internally stored dual configuration flash

• User flash memory

• Instant on support

•Integrated analog-to-digital converters (ADCs)

• Single-chip Nios II soft core processor support

Intel MAX 10 devices are the ideal solution for system management, I/O expansion,

communication control planes, industrial, automotive, and consumer applications.

Summary of Intel MAX 10 Device Features

Technology

55 nm TSMC Embedded Flash (Flash + SRAM) process technology

Packaging

• Low cost, small form factor packages—support multiple packaging technologies and pin pitches

• Multiple device densities with compatible package footprints for seamless migration between different device densities

• RoHS6-compliant

Core architecture

•4-input look-up table (LUT) and single register logic element (LE)

•LEs arranged in logic array block (LAB)

•Embedded RAM and user flash memory

• Clocks and PLLs

•Embedded multiplier blocks

• General purpose I/Os

Internal memory blocks

•M9K—9 kilobits (Kb) memory blocks

• Cascadable blocks to create RAM, dual port, and FIFO functions

User flash memory (UFM)

• User accessible non-volatile storage

• High speed operating frequency

• Large memory size

• High data retention

• Multiple interface option

Embedded multiplier blocks

• One 18 × 18 or two 9 × 9 multiplier modes

• Cascadable blocks enabling creation of filters, arithmetic functions, and image processing pipelines

ADC

•12-bit successive approximation register (SAR) type

• Up to 17 analog inputs

• Cumulative speed up to 1 million samples per second ( MSPS)

•Integrated temperature sensing capability

Clock networks

• Global clocks support

• High speed frequency in clock network

Internal oscillator

Built-in internal ring oscillator

PLLs

• Analog-based

• Low jitter

•High precision clock synthesis

• Clock delay compensation

• Zero delay buffering

• Multiple output taps

General-purpose I/Os (GPIOs)

• Multiple I/O standards support

• On-chip termination (OCT)

•Up to 830 megabits per second (Mbps) LVDS receiver, 800 Mbps LVDS

transmitter

External memory interface (EMIF) (1)

Supports up to 600 Mbps external memory interfaces:

•DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)

•SRAM (Hardware support only)

Note: For 600 Mbps performance, –6 device speed grade is required.

Performance varies according to device grade (commercial, industrial, or

automotive) and device speed grade (–6 or –7). Refer to the Intel MAX

10 FPGA Device Datasheet or External Memory Interface Spec Estimator

for more details.

Configuration

• Internal configuration

• JTAG

• Advanced Encryption Standard (AES) 128-bit encryption and compression

options

• Flash memory data retention of 20 years at 85 °C

Flexible power supply schemes

• Single- and dual-supply device options

• Dynamically controlled input buffer power down

• Sleep mode for dynamic power reduction

How to choose FPGA for your project?

PDF

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Cyclone® V SE FPGA - 25K Logic Elements 800MHz 484-UBGA (19x19)

Summary of Features for Cyclone V Devices

Technology

• TSMC's 28-nm low-power (28LP) process technology

• 1.1 V core voltage

Packaging

• Wirebond low-halogen packages

• Multiple device densities with compatible package footprints for seamless migration between

different device densities

• RoHS-compliant and leaded(1)options

High-performance FPGA fabric

Enhanced 8-input ALM with four registers

Internal memory blocks

• M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)

• Memory logic array block (MLAB)—640-bit distributed LUTRAM where you can use up to 25%

of the ALMs as MLAB memory

Embedded Hard IP blocks

Variable-precision DSP

• Native support for up to three signal processing precision levels

(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the same

variable-precision DSP block

• 64-bit accumulator and cascade

• Embedded internal coefficient memory

• Preadder/subtractor for improved efficiency

Memory controller

DDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC support

Embedded transceiver I/O

PCI Express* (PCIe*) Gen2 and Gen1 (x1, x2, or x4) hard IP with

multifunction support, endpoint, and root port

Clock networks

• Up to 550 MHz global clock network

• Global, quadrant, and peripheral clock networks

• Clock networks that are not used can be powered down to reduce dynamic power

Phase-locked loops (PLLs)

• Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)

• Integer mode and fractional mode

FPGA General-purpose I/Os (GPIOs)

• 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter

• 400 MHz/800 Mbps external memory interface

• On-chip termination (OCT)

• 3.3 V support with up to 16 mA drive strength

Low-power high-speed serial interface

• 614 Mbps to 6.144 Gbps integrated transceiver speed

• Transmit pre-emphasis and receiver equalization

• Dynamic partial reconfiguration of individual channels

HPS(Cyclone V SE, SX,and ST devices only)

• Single or dual-core Arm Cortex-A9 MPCore processor-up to 925 MHz maximum frequency with

support for symmetric and asymmetric multiprocessing

• Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0

On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller, NAND

flash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART, controller area

network (CAN), serial peripheral interface (SPI), I2C interface, and up to 85 HPS GPIO

interfaces

• System peripherals—general-purpose timers, watchdog timers, direct memory access (DMA)

controller, FPGA configuration manager, and clock and reset managers

• On-chip RAM and boot ROM

• HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweight HPS-to-FPGA

bridges that allow the FPGA fabric to issue transactions to slaves in the HPS, and vice versa

• FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface to the multiport

front end (MPFE) of the HPS SDRAM controller

• Arm CoreSight™ JTAG debug access port, trace port, and on-chip trace storage

Configuration

• Tamper protection—comprehensive design protection to protect your valuable IP investments

• Enhanced advanced encryption standard (AES) design security features

• CvP

• Dynamic reconfiguration of the FPGA

• Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP) x8 and

x16 configuration options

• Internal scrubbing (2)

• Partial reconfiguration (3)