Lattice Semiconductor Corporation

iCE40™ LP Field Programmable Gate Array (FPGA) IC 21 384 32-VFQFN Exposed Pad

General Description

The iCE40 family of ultra-low power, non-volatile FPGAs has five devices with densities ranging from 384 to 7680Look-Up

Tables (LUTs). In addition to LUT-based, low-cost programmable logic, these devices feature EmbeddedBlock RAM (EBR),

Non-volatile Configuration Memory (NVCM) and Phase Locked Loops (PLLs). These featuresallow the devices to be used

in low-cost, high-volume consumer and system applications. Select packages offerHigh-Current drivers that are ideal to

drive three white LEDs, or one RGB LED.

The iCE40 devices are fabricated on a 40 nm CMOS low power process. The device architecture has several features such

as programmable low-swing differential I/Os and the ability to turn off on-chip PLLs dynamically. Thesefeatures help

manage static and dynamic power consumption, resulting in low static power for all members of thefamily. The iCE40

devices are available in two versions – ultra low power (LP) and high performance (HX) devices.

The iCE40 FPGAs are available in a broad range of advanced halogen-free packages ranging from the spacesaving

1.40x1.48 mm WLCSP to the PCB-friendly 20x20 mm TQFP. Table 1-1 shows the LUT densities, packageand I/O options,

along with other key parameters.

The iCE40 devices offer enhanced I/O features such as pull-up resistors. Pull-up features are controllable on a“per-pin”

basis.

The iCE40 devices also provide flexible, reliable and secure configuration from on-chip NVCM. These devices canalso

configure themselves from external SPI Flash or be configured by an external master such as a CPU.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the iCE40family

of devices. Popular logic synthesis tools provide synthesis library support for iCE40. Lattice design tools usethe synthesis

tool output along with the user-specified preferences and constraints to place and route the design inthe iCE40 device.

These tools extract the timing from the routing and back-annotate it into the design for timing ver-ification.

Lattice provides many pre-engineered IP (Intellectual Property) modules, including a number of reference designs,licensed

free of charge, optimized for the iCE40 FPGA family. By using these configurable soft core IP cores asstandardized blocks,

users are free to concentrate on the unique aspects of their design, increasing their productivity.

Features

• Flexible Logic Architecture

      Five devices with 384 to 7,680 LUT4s and10 to 206 I/Os

• Ultra Low Power Devices

      Advanced 40 nm low power process

      As low as 21 µA standby power

      Programmable low swing differential I/Os

• Embedded and Distributed Memory

      Up to 128 kbits sysMEM™ Embedded Block RAM

• Pre-Engineered Source Synchronous I/O

      DDR registers in I/O cells

• High Current LED Drivers

      Three High Current Drivers used for three differ-ent LEDs or one RGB LED

• High Performance, Flexible I/O Buffer

      Programmable sysIO™ buffer supports wide range of interfaces:

      — LVCMOS 3.3/2.5/1.8

      — LVDS25E, subLVDS

      — Schmitt trigger inputs, to 200 mV typical hysteresis

      Programmable pull-up mode

• Flexible On-Chip Clocking

      Eight low-skew global clock resources

      Up to two analog PLLs per device

• Flexible Device Configuration

      SRAM is configured through:

      — Standard SPI Interface

      — Internal Nonvolatile Configuration Memory (NVCM)

• Broad Range of Package Options

      WLCSP, QFN, VQFP, TQFP, ucBGA, caBGA, and csBGA package options

      Small footprint package options

      — As small as 1.40 mm x 1.48 mm

      Advanced halogen-free packaging

How to choose FPGA for your project?

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MachXO2 Field Programmable Gate Array (FPGA) IC 21 256 32-UFQFN Exposed Pad

General Description

The MachXO2 family of ultra low power, instant-on, non-volatile PLDs has six devices with densities ranging from 256 to

6864 Look-Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic these devices feature Embedded

Block RAM (EBR), Distributed RAM, User Flash Memory (UFM), Phase Locked Loops (PLLs), preengineered source

synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of

commonly used functions such as SPI controller, I²C controller and timer/counter. These features allow these devices to

be used in low cost, high volume consumer and system applications.

The MachXO2 devices are designed on a 65 nm non-volatile low power process. The device architecture has several

features such as programmable low swing differential I/Os and the ability to turn off I/O banks, on-chip PLLs and

oscillators dynamically. These features help manage static and dynamic power consumption resulting in low static power

for all members of the family.

The MachXO2 devices are available in two versions – ultra low power (ZE) and high performance (HC and HE) devices.

The ultra low power devices are offered in three speed grades –1, –2 and –3, with –3 being the fastest. Similarly, the

high-performance devices are offered in three speed grades: –4, –5 and –6, with –6 being the fastest. HC devices have an

internal linear voltage regulator which supports external VCC supply voltages of 3.3 V or 2.5 V. ZE and HE devices only

accept 1.2 V as the external VCC supply voltage. With the exception of power supply voltage all three types of devices

(ZE, HC and HE) are functionally compatible and pin compatible with each other.

The MachXO2 PLDs are available in a broad range of advanced halogen-free packages ranging from the space saving

2.5 mm x 2.5 mm WLCSP to the 23 mm x 23 mm fpBGA. MachXO2 devices support density migration within the same

package. Table 1-1 shows the LUT densities, package and I/O options, along with other key parameters.

The pre-engineered source synchronous logic implemented in the MachXO2 device family supports a broad range of

interface standards, including LPDDR, DDR, DDR2 and 7:1 gearing for display I/Os.

The MachXO2 devices offer enhanced I/O features such as drive strength control, slew rate control, PCI compati bility,

bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. Pull-up, pull-down and

bus-keeper features are controllable on a“per-pin”basis.

A user-programmable internal oscillator is included in MachXO2 devices. The clock output from this oscillator may be

divided by the timer/counter for use as clock input in functions such as LED control, key-board scanner and sim-ilar state

machines.

The MachXO2 devices also provide flexible, reliable and secure configuration from on-chip Flash memory. These devices

can also configure themselves from external SPI Flash or be configured by an external master through the JTAG test

access port or through the I2C port. Additionally, MachXO2 devices support dual-boot capability (using external Flash

memory) and remote field upgrade (TransFR) capability.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the MachXO2

family of devices. Popular logic synthesis tools provide synthesis library support for MachXO2. Lattice design tools use the

synthesis tool output along with the user-specified preferences and constraints to place and route the design in the

MachXO2 device. These tools extract the timing from the routing and back-annotate it intothe design for timing

verification.

Lattice provides many pre-engineered IP (Intellectual Property) LatticeCORE™ modules, including a number of reference

designs licensed free of charge, optimized for the MachXO2 PLD family. By using these configurable soft core IP cores as

standardized blocks, users are free to concentrate on the unique aspects of their design, increasing their productivity.

Features

• Flexible Logic Architecture

      Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os

• Ultra Low Power Devices

      Advanced 65 nm low power process

      As low as 22 µW standby power

      Programmable low swing differential I/Os

      Stand-by mode and other power saving options

• Embedded and Distributed Memory

      Up to 240 kbits sysMEM™ Embedded BlockRAM

      Up to 54 kbits Distributed RAM

      Dedicated FIFO control logic

• On-Chip User Flash Memory

      Up to 256 kbits of User Flash Memory

      100,000 write cycles

      Accessible through WISHBONE, SPI, I2C and JTAG interfaces

      Can be used as soft processor PROM or as Flash memory

• Pre-Engineered Source Synchronous I/O

      DDR registers in I/O cells

      Dedicated gearing logic

      7:1 Gearing for Display I/Os

      Generic DDR, DDRX2, DDRX4

      Dedicated DDR/DDR2/LPDDR memory with DQS support

• High Performance, Flexible I/O Buffer

      Programmable sysIO™ buffer supports wide range of interfaces:

      – LVCMOS 3.3/2.5/1.8/1.5/1.2

      – LVTTL

      – PCI

      – LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL

      – SSTL 25/18

      – HSTL 18

      – Schmitt trigger inputs, up to 0.5 V hysteresis

      I/Os support hot socketing

      On-chip differential termination

      Programmable pull-up or pull-down mode

• Flexible On-Chip Clocking

      Eight primary clocks

      Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)

      Up to two analog PLLs per device with fractional-n frequency synthesis

      – Wide input frequency range (7 MHz to 400 MHz)

• Non-volatile, Infinitely Reconfigurable

      Instant-on – powers up in microseconds

      Single-chip, secure solution

      Programmable through JTAG, SPI or I²C

      Supports background programming of non-vola-tile memory

      Optional dual boot with external SPI memory

• TransFR™ Reconfiguration

      In-field logic update while system operates

• Enhanced System Level Support

      On-chip hardened functions: SPI, I²C, timer/counter

      On-chip oscillator with 5.5% accuracy

      Unique TraceID for system tracking

      One Time Programmable (OTP) mode

      Single power supply with extended operating range

      IEEE Standard 1149.1 boundary scan

      IEEE 1532 compliant in-system programming

• Broad Range of Package Options

      TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options

      Small footprint package options

      – As small as 2.5 mm x 2.5 mm

      Density migration supported

      Advanced halogen-free packaging

How to choose FPGA for your project?

PDF