Microsemi Corporation

IGLOO nano Field Programmable Gate Array (FPGA) IC 34 768 48-VFQFN Exposed Pad

General Description

The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced features.

The Flash*Freeze technology used in IGLOO nano devices enables entering and exiting an ultra-low power mode that

consumes nanoPower while retaining SRAM and register data. Flash*Freeze technology simplifies power management

through l/O and clock management with rapid recovery to operation mode.

The Low Power Active capability (static idle) allows for ultra-low power consumption while the IGLOO nano device is

completely functional in the system. This allows the IGLO0 nano device to control system power management based on

external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power.

Nonvolatile flash technology gives lGLOO nano devices the advantage of being a secure, low power, single-chip solution

that is Instant On. The IGLOO nano device is reprogrammable and offers time-to-market benefits at an ASIC-level unit

cost.

These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.

IGLOO nano devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning

circuitry based on an integrated phase-locked loop (PLL). The AGLN030 and smaller devices have no PLL or RAM support.

IGLOO nano devices have up to 250 k system gates, supported with up to 36 kbits of true dual-port SRAM and up to 71

user l/Os.

IGLOO nano devices increase the breadth of the IGLOO product line by adding new features and packages for greater

customer value in high volume consumer, portable, and battery-backed markets. Features such as smaller footprint

packages designed with two-layer PCBs in mind, power consumption measured in nanoPower, Schmitt trigger, and bus

hold (hold previous l/O state in Flash*Freeze mode) functionality make these devices ideal for deployment in applications

that require high levels of flexibility and low cost.

Features and Benefits

• Low Power

      nanoPower Consumption-Industry's Lowest Power

      1.2 V to 1.5 V Core Voltage Support for Low Power

      Supports Single-Voltage System Operation

      Low Power Active FPGA Operation

      Flash*Freeze Technology Enables Ultra-Low Power Consumption while MaintainingFPGA Content

      Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode

• Small Footprint Packages

      As Small as 3x3 mm in Size

• Wide Range of Features

      10,000 to 250,000 System Gates

      Up to 36 kbits of True Dual-Port SRAM

      Up to 71 User 1/Os

• Reprogrammable Flash Technology

      130-nm, 7-Layer Metal, Flash-Based CMOS Process

      Instant On Level 0 Support

      Single-Chip Solution

      Retains Programmed Design When Powered Off

      250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance

• In-System Programming (ISP) and Security

      ISP Using On-Chip 128-BitAdvanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532-compliant)

      FlashLock®Designed to Secure FPGA Contents

      1.2 V Programming

• High-Performance Routing Hierarchy

      Segmented,Hierarchical Routing and Clock Structure

• Advanced I/Os

      1.2 V, 1.5 V, 1.8 V, 2.5 V,and 3.3 V Mixed-Voltage Operation

      Bank-Selectable I/O Voltages-up to 4 Banks per Chip

      Single-Ended I/O Standards:LVTTL,LVCMOS 3.3V/2.5 V/ 1.8 V/1.5 V/1.2V

      Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6V

      Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575V

      I/O Registers on Input, Output, and Enable Paths

      Selectable Schmitt Trigger Inputs

      Hot-Swappable and Cold-Sparing I/Os

      Programmable Output Slew Rate and Drive Strength

      Weak Pull-Up/-Down

      IEEE 1149.1(JTAG) Boundary Scan Test

      Pin-Compatible Packages across the IGLOO®Family

• Clock Conditioning Circuit(CCC) and PLLt

      Up to Six CCC Blocks, One with an Integrated PLL

      Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback

      Wide Input Frequency Range (1.5 MHz up to 250 MHz)

• Embedded Memory

      1 kbit of FlashROM User Nonvolatile Memory

      SRAMs and FIFOs with Variable-Aspect-Ratio4,608-Bit RAM Blocks (x1, x2, x4, x9, and x18 organizations)

      True Dual-Port SRAM(except x18 organization)

• Enhanced Commercial Temperature Range

      Tj=-20℃ to +85℃

How to choose FPGA for your project?

PDF

IGLOO nano Field Programmable Gate Array (FPGA) IC 77 768 100-TQFP

General Description

The IGLOO family of flash FPGAs, based on a 130-nm flash process, offers the lowest power FPGA, a single-chip solution,

small footprint packages, reprogrammability, and an abundance of advanced features.

The Flash*Freeze technology used in IGLOO nano devices enables entering and exiting an ultra-low power mode that

consumes nanoPower while retaining SRAM and register data. Flash*Freeze technology simplifies power management

through l/O and clock management with rapid recovery to operation mode.

The Low Power Active capability (static idle) allows for ultra-low power consumption while the IGLOO nano device is

completely functional in the system. This allows the IGLO0 nano device to control system power management based on

external inputs (e.g., scanning for keyboard stimulus) while consuming minimal power.

Nonvolatile flash technology gives lGLOO nano devices the advantage of being a secure, low power, single-chip solution

that is Instant On. The IGLOO nano device is reprogrammable and offers time-to-market benefits at an ASIC-level unit

cost.

These features enable designers to create high-density systems using existing ASIC or FPGA design flows and tools.

IGLOO nano devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as clock conditioning

circuitry based on an integrated phase-locked loop (PLL). The AGLN030 and smaller devices have no PLL or RAM support.

IGLOO nano devices have up to 250 k system gates, supported with up to 36 kbits of true dual-port SRAM and up to 71

user l/Os.

IGLOO nano devices increase the breadth of the IGLOO product line by adding new features and packages for greater

customer value in high volume consumer, portable, and battery-backed markets. Features such as smaller footprint

packages designed with two-layer PCBs in mind, power consumption measured in nanoPower, Schmitt trigger, and bus

hold (hold previous l/O state in Flash*Freeze mode) functionality make these devices ideal for deployment in applications

that require high levels of flexibility and low cost.

Features and Benefits

• Low Power

      nanoPower Consumption-Industry's Lowest Power

      1.2 V to 1.5 V Core Voltage Support for Low Power

      Supports Single-Voltage System Operation

      Low Power Active FPGA Operation

      Flash*Freeze Technology Enables Ultra-Low Power Consumption while MaintainingFPGA Content

      Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode

• Small Footprint Packages

      As Small as 3x3 mm in Size

• Wide Range of Features

      10,000 to 250,000 System Gates

      Up to 36 kbits of True Dual-Port SRAM

      Up to 71 User 1/Os

• Reprogrammable Flash Technology

      130-nm, 7-Layer Metal, Flash-Based CMOS Process

      Instant On Level 0 Support

      Single-Chip Solution

      Retains Programmed Design When Powered Off

      250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System Performance

• In-System Programming (ISP) and Security

      ISP Using On-Chip 128-BitAdvanced Encryption Standard (AES) Decryption via JTAG (IEEE 1532-compliant)

      FlashLock®Designed to Secure FPGA Contents

      1.2 V Programming

• High-Performance Routing Hierarchy

      Segmented,Hierarchical Routing and Clock Structure

• Advanced I/Os

      1.2 V, 1.5 V, 1.8 V, 2.5 V,and 3.3 V Mixed-Voltage Operation

      Bank-Selectable I/O Voltages-up to 4 Banks per Chip

      Single-Ended I/O Standards:LVTTL,LVCMOS 3.3V/2.5 V/ 1.8 V/1.5 V/1.2V

      Wide Range Power Supply Voltage Support per JESD8-B, Allowing I/Os to Operate from 2.7 V to 3.6V

      Wide Range Power Supply Voltage Support per JESD8-12, Allowing I/Os to Operate from 1.14 V to 1.575V

      I/O Registers on Input, Output, and Enable Paths

      Selectable Schmitt Trigger Inputs

      Hot-Swappable and Cold-Sparing I/Os

      Programmable Output Slew Rate and Drive Strength

      Weak Pull-Up/-Down

      IEEE 1149.1(JTAG) Boundary Scan Test

      Pin-Compatible Packages across the IGLOO®Family

• Clock Conditioning Circuit(CCC) and PLLt

      Up to Six CCC Blocks, One with an Integrated PLL

      Configurable Phase Shift, Multiply/Divide, Delay Capabilities, and External Feedback

      Wide Input Frequency Range (1.5 MHz up to 250 MHz)

• Embedded Memory

      1 kbit of FlashROM User Nonvolatile Memory

      SRAMs and FIFOs with Variable-Aspect-Ratio4,608-Bit RAM Blocks (x1, x2, x4, x9, and x18 organizations)

      True Dual-Port SRAM(except x18 organization)

• Enhanced Commercial Temperature Range

      Tj=-20℃ to +85℃

How to choose FPGA for your project?

PDF