Lattice Semiconductor Corporation

iCE40 Ultra™ Field Programmable Gate Array (FPGA) IC 39 65536 1100 48-VFQFN Exposed Pad

General Description

iCE40 Ultra family is an ultra-low power FPGA and sensor manager designed for ultra-low power mobile applications,

such as smartphones, tablets and hand-held devices. The iCE40 Ultra family includes integrated SPI and I²Cblocks to

interface with virtually all mobile sensors and application processors. The iCE40 Ultra family also featurestwo on-chip

oscillators, 10 kHz and 48 MHz. The LFOSC (10 kHz) is ideal for low power function in always-on applications, while

HFOSC (48 MHz) can be used for awaken activities.

The iCE40 Ultra family also features DSP functional block to off-load Application Processor to pre-process information

sent from the mobile sensors. The embedded RGB PWM IP, with the three 24 mA constant current RGB outputs on the

iCE40 Ultra provides all the necessary logic to directly drive the service LED, without the need ofexternal MOSFET or

buffer.

The 500 mA constant current IR driver output provides a direct interface to external LED for application such asIrDA

functions. Users simply implement the modulation logic that meets his needs, and connect the IR driverdirectly to the

LED, without the need of external MOSFET or buffer. This high current IR driver can also be used asBarcode Emulation,

sending barcode information to external Barcode Reader.

The iCE40 Ultra family of devices are targeting for mobile applications to perform functions such as IrDA, ServiceLED,

Barcode Emulation, GPIO Expander, SDIO Level Shift, and other custom functions.

The iCE40 Ultra family features three device densities, from 1100 to 3520 Look Up Tables (LUTs) of logic with

programmable I/Os that can be used as either SPI/I²C interface ports or general purpose I/O’s. It also has up to 80kbits

of Block RAMs to work with user logic.

Features

• Flexible Logic Architecture

      Three devices with 1100 to 3520 LUTs

      Offered in WLCS, ucfBGA and QFN packages

• Ultra-low Power Devices

      Advanced 40 nm ultra-low power process

      As low as 71 µA standby current typical

• Embedded Memory

      Up to 80 kbits sysMEM™ Embedded Block RAM

• Two Hardened I2C Interfaces

• Two Hardened SPI Interfaces

• Two On-Chip Oscillators

      Low Frequency Oscillator – 10 kHz

      High Frequency Oscillator – 48 MHz

• 24 mA Current Drive RGB LED Outputs

      Three drive outputs in each device

      User selectable sink current up to 24 mA

• 500 mA Current Drive IR LED Output

      One IR drive output in each device

      User selectable sink current up to 500 mA

• On-chip DSP

      Signed and unsigned 8-bit or 16-bit functions

      Functions include Multiplier, Accumulator, and Multiply-Accumulate (MAC)

• Flexible On-Chip Clocking

      Eight low skew global signal resource, six can be directly driven from external pins

      One PLL with dynamic interface per device

• Flexible Device Configuration

      SRAM is configured through:

      — Standard SPI Interface

      — Internal Nonvolatile Configuration Memory (NVCM)

• Ultra-Small Form Factor

      As small as 2.078 mm x 2.078 mm

• Applications

      Smartphones

      Tablets and Consumer Handheld Devices

      Handheld Commercial and Industrial Devices

      Multi Sensor Management Applications

      Sensor Pre-processing and Sensor Fusion

      Always-On Sensor Applications

      USB 3.1 Type C Cable Detect / Power Delivery Applications

How to choose FPGA for your project?

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MachXO2 Field Programmable Gate Array (FPGA) IC 40 256 48-VFQFN Exposed Pad

General Description

The MachXO2 family of ultra low power, instant-on, non-volatile PLDs has six devices with densities ranging from 256 to

6864 Look-Up Tables (LUTs). In addition to LUT-based, low-cost programmable logic these devices feature Embedded

Block RAM (EBR), Distributed RAM, User Flash Memory (UFM), Phase Locked Loops (PLLs), preengineered source

synchronous I/O support, advanced configuration support including dual-boot capability and hardened versions of

commonly used functions such as SPI controller, I²C controller and timer/counter. These features allow these devices to

be used in low cost, high volume consumer and system applications.

The MachXO2 devices are designed on a 65 nm non-volatile low power process. The device architecture has several

features such as programmable low swing differential I/Os and the ability to turn off I/O banks, on-chip PLLs and

oscillators dynamically. These features help manage static and dynamic power consumption resulting in low static power

for all members of the family.

The MachXO2 devices are available in two versions – ultra low power (ZE) and high performance (HC and HE) devices.

The ultra low power devices are offered in three speed grades –1, –2 and –3, with –3 being the fastest. Similarly, the

high-performance devices are offered in three speed grades: –4, –5 and –6, with –6 being the fastest. HC devices have an

internal linear voltage regulator which supports external VCC supply voltages of 3.3 V or 2.5 V. ZE and HE devices only

accept 1.2 V as the external VCC supply voltage. With the exception of power supply voltage all three types of devices

(ZE, HC and HE) are functionally compatible and pin compatible with each other.

The MachXO2 PLDs are available in a broad range of advanced halogen-free packages ranging from the space saving

2.5 mm x 2.5 mm WLCSP to the 23 mm x 23 mm fpBGA. MachXO2 devices support density migration within the same

package. Table 1-1 shows the LUT densities, package and I/O options, along with other key parameters.

The pre-engineered source synchronous logic implemented in the MachXO2 device family supports a broad range of

interface standards, including LPDDR, DDR, DDR2 and 7:1 gearing for display I/Os.

The MachXO2 devices offer enhanced I/O features such as drive strength control, slew rate control, PCI compati bility,

bus-keeper latches, pull-up resistors, pull-down resistors, open drain outputs and hot socketing. Pull-up, pull-down and

bus-keeper features are controllable on a“per-pin”basis.

A user-programmable internal oscillator is included in MachXO2 devices. The clock output from this oscillator may be

divided by the timer/counter for use as clock input in functions such as LED control, key-board scanner and sim-ilar state

machines.

The MachXO2 devices also provide flexible, reliable and secure configuration from on-chip Flash memory. These devices

can also configure themselves from external SPI Flash or be configured by an external master through the JTAG test

access port or through the I2C port. Additionally, MachXO2 devices support dual-boot capability (using external Flash

memory) and remote field upgrade (TransFR) capability.

Lattice provides a variety of design tools that allow complex designs to be efficiently implemented using the MachXO2

family of devices. Popular logic synthesis tools provide synthesis library support for MachXO2. Lattice design tools use the

synthesis tool output along with the user-specified preferences and constraints to place and route the design in the

MachXO2 device. These tools extract the timing from the routing and back-annotate it intothe design for timing

verification.

Lattice provides many pre-engineered IP (Intellectual Property) LatticeCORE™ modules, including a number of reference

designs licensed free of charge, optimized for the MachXO2 PLD family. By using these configurable soft core IP cores as

standardized blocks, users are free to concentrate on the unique aspects of their design, increasing their productivity.

Features

• Flexible Logic Architecture

      Six devices with 256 to 6864 LUT4s and 18 to 334 I/Os

• Ultra Low Power Devices

      Advanced 65 nm low power process

      As low as 22 µW standby power

      Programmable low swing differential I/Os

      Stand-by mode and other power saving options

• Embedded and Distributed Memory

      Up to 240 kbits sysMEM™ Embedded BlockRAM

      Up to 54 kbits Distributed RAM

      Dedicated FIFO control logic

• On-Chip User Flash Memory

      Up to 256 kbits of User Flash Memory

      100,000 write cycles

      Accessible through WISHBONE, SPI, I2C and JTAG interfaces

      Can be used as soft processor PROM or as Flash memory

• Pre-Engineered Source Synchronous I/O

      DDR registers in I/O cells

      Dedicated gearing logic

      7:1 Gearing for Display I/Os

      Generic DDR, DDRX2, DDRX4

      Dedicated DDR/DDR2/LPDDR memory with DQS support

• High Performance, Flexible I/O Buffer

      Programmable sysIO™ buffer supports wide range of interfaces:

      – LVCMOS 3.3/2.5/1.8/1.5/1.2

      – LVTTL

      – PCI

      – LVDS, Bus-LVDS, MLVDS, RSDS, LVPECL

      – SSTL 25/18

      – HSTL 18

      – Schmitt trigger inputs, up to 0.5 V hysteresis

      I/Os support hot socketing

      On-chip differential termination

      Programmable pull-up or pull-down mode

• Flexible On-Chip Clocking

      Eight primary clocks

      Up to two edge clocks for high-speed I/O interfaces (top and bottom sides only)

      Up to two analog PLLs per device with fractional-n frequency synthesis

      – Wide input frequency range (7 MHz to 400 MHz)

• Non-volatile, Infinitely Reconfigurable

      Instant-on – powers up in microseconds

      Single-chip, secure solution

      Programmable through JTAG, SPI or I²C

      Supports background programming of non-vola-tile memory

      Optional dual boot with external SPI memory

• TransFR™ Reconfiguration

      In-field logic update while system operates

• Enhanced System Level Support

      On-chip hardened functions: SPI, I²C, timer/counter

      On-chip oscillator with 5.5% accuracy

      Unique TraceID for system tracking

      One Time Programmable (OTP) mode

      Single power supply with extended operating range

      IEEE Standard 1149.1 boundary scan

      IEEE 1532 compliant in-system programming

• Broad Range of Package Options

      TQFP, WLCSP, ucBGA, csBGA, caBGA, ftBGA, fpBGA, QFN package options

      Small footprint package options

      – As small as 2.5 mm x 2.5 mm

      Density migration supported

      Advanced halogen-free packaging

How to choose FPGA for your project?

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