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    LFE2M50E-7F672C
    ECP2M Field Programmable Gate Array (FPGA) IC 372 4246528 48000 672-BBGA
    7000
    672-BBGA
    A Comprehensive Guide To LIFCL-40-9MG121I CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 72 1548288 39000 121-VFBGA, CSPBGA

    CrossLink-NX™ Field Programmable Gate Array (FPGA) IC 72 1548288 39000 121-VFBGA, CSPBGA


    General Description

    CrossLink™-NX family of low-power FPGAs can be used in a wide range of applications, and are optimized for bridging and

    processing needs in Embedded Vision applications – supporting a variety of high bandwidth sensor and display interfaces,

    video processing and machine learning inferencing. It is built on Lattice Nexus FPGA platform, using low-power 28 nm

    FD-SOI technology. It combines the extreme flexibility of an FPGA with the low power and high reliability (due to extremely

    low SER) of FD-SOI technology, and offers small footprint package options.

    CrossLink-NX supports a variety of interfaces including MIPI D-PHY (CSI-2, DSI), LVDS, SLVS, subLVDS, PCI Express (Gen1,

    Gen2), SGMII (Gigabit Ethernet), and more.

    Processing features of CrossLink-NX include up to 39K Logic Cells, 56 18x18 multipliers, 2.9 Mb of embedded memory

    (consisting of EBR and LRAM blocks), distributed memory, DRAM interfaces (supporting DDR3, DDR3L, LPDDR2, and

    LPDDR3 up to 1066 Mbps x16 data width).

    CrossLink-NX FPGAs support fast configuration of its reconfigurable SRAM-based logic fabric, and ultra-fast configuration

    (in under 3 ms) of its programmable sysI/O™. Security features to secure user designs include bitstream encryption and

    password protection. In addition to the high reliability inherent to FD-SOI technology (due to its extremely low SER), active

    reliability features such as built-in frame-based SED/SEC (for SRAM-based logic fabric), and ECC (for EBR and LRAM) are

    also supported. Built-in ADC is available in each device for system monitoring functions.

    Lattice Radiant™ design software allows large complex user designs to be efficiently implemented on CrossLink-NX FPGA

    family. Synthesis library support for CrossLink-NX devices is available for popular logic synthesis tools. Radiant tools use the

    synthesis tool output along with constraints from its floor planning tools, to place and route the user design in

    CrossLink-NX device. The tools extract timing from the routing, and back-annotate it into the design for timing verification.

    Lattice provides many pre-engineered IP (Intellectual Property) modules for CrossLink-NX family. By using these

    configurable soft IP cores as standardized blocks, you are free to concentrate on the unique aspects of your design,

    increasing your productivity.


    Features

    • Programmable Architecture

          17K to 39K logic cells

          24 to 56 18 x 18 multipliers (in sysDSP™ blocks)

          2.5 to 2.9 Mb of embedded memory blocks (EBR, LRAM)

          36 to 192 programmable sysI/O (High Performance and Wide Range I/O)

    • MIPI D-PHY

          Up to two hardened 4-lane MIPI D-PHY interfaces

                Up to eight lanes total

                Transmit or receive

                Supports CSI-2, DSI

                20 Gbps aggregate bandwidth

                2.5 Gbps per lane, 10 Gbps per D-PHY interface

          Additional Soft D-PHY interfaces supported by High Performance (HP) sysI/O

                Transmit or receive

                Supports CSI-2, DSI

                Up to 1.5 Gbps per lane

    • Programmable sysI/O supports wide variety of interfaces

          High Performance (HP) on bottom I/O dual rank

                Supports up to 1.8 V VCCIO

                Mixed voltage support (1.0 V, 1.2 V, 1.5 V, 1.8 V)

                High-speed differential up to 1.5 Gbps

                Supports soft D-PHY (Tx/Rx), LVDS 7:1 (Tx/Rx), SLVS (Tx/Rx), subLVDS (Rx)

                Supports SGMII (Gb Ethernet) – 2 channels (Tx/Rx) at 1.25 Gbps

                Dedicated DDR3/DDR3L and LPDDR2/LPDDR3 memory support with DQS logic, up to 1066 Mbps data-rate and

                x16 data-width

          Wide Range (WR) on Left, Right and Top I/O Banks

                Supports up to 3.3 V VCCIO

                Mixed voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V)

                Programmable slew rate (slow, med, fast)

                Controlled impedance mode

                Emulated LVDS support

                Hot-socketing

    • Power Modes – Low Power versus High Performance

          User selectable

          Low-Power mode for power and/or thermal challenges

          High-Performance mode for faster processing

    • Small footprint package options

          4 x 4 mm2to 10 x 10 mm2 package options

    • 2x SGMII CDR at up to 1.25 Gbps – to support 2 channels SGMII using HP I/O

          CDR for RX

          8b/10b decoding

          Independent Loss of Lock (LOL) detector for each CDR block

    • sysCLOCK™ analog PLLs

          Three in 39K LC and two in 17K LC device

          Six outputs per PLL

          Fractional N

          Programmable and dynamic phase control

    • sysDSP Enhanced DSP blocks

          Hardened pre-adder

          Dynamic Shift for AI/ML support

          Four 18 x 18, eight 9 x 9, two 18 x 36, or 36 x 36

          Advanced 18 x 36, two 18 x 18, or four 8 x 8 MAC

    • Flexible memory resources

          Up to 1.5 Mb sysMEM™ Embedded Block RAM EBR)

          Programmable width

          ECC

          FIFO

          80k to 240k bits distributed RAM

          Large RAM Blocks

                0.5 Mbits per block

                Up to five blocks (2.5 Mb total) per device

    • SERDES – PCIe Gen2 x1 channel (Tx/Rx) hard IP in 39K LC device

          Hard IP supports

                Gen1, Gen2, Multi-Function, End Point, Root Complex

                APB control bus

                AHB-Lite for data bus

    • Internal bus interface support

          APB control bus

          AHB-Lite for data bus

          AXI4-streaming 

    • Configuration – Fast, Secure

          SPI – x1, x2, x4 up to 150 MHz

                Master and Slave SPI support

          JTAG

          I²C and I3C

          Ultrafast I/O configuration for instant-on support

          Less than 15 ms full device configuration for LIFCL-40

          Bitstream Security

                Encryption

    • Cryptographic engine

          Bitstream encryption – using AES-256

          Bitstream authentication – using ECDSA

          Hashing algorithms – SHA, HMAC

          True Random Number Generator

          AES 128/256 Encryption

    • Single Event Upset (SEU) Mitigation Support

          Extremely low Soft Error Rate (SER) due to FD SOI technology

          Soft Error Detect – Embedded hard macro

          Soft Error Correction – Without stopping user operation

          Soft Error Injection – Emulate SEU event to debug system error handling

    • ADC – 1 MSPS, 12-bit SAR

          2 ADCs per device

          3 Continuous-time Comparators

          Simultaneous sampling

    • System Level Support

          IEEE 1149.1 and IEEE 1532 compliant

          Reveal Logic Analyzer

          On-chip oscillator for initialization and general use

          1.0 V core power supply


    How to choose FPGA for your project?



                                                                 



    PDF

    484
    121-VFBGA, CSPBGA
    LFE2M70E-5F1152I
    ECP2M Field Programmable Gate Array (FPGA) IC 436 4642816 67000 1152-BBGA
    1166
    1152-BBGA
    A Comprehensive Guide To LFD2NX-40-8BG256I Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA

    Certus™-NX Field Programmable Gate Array (FPGA) IC 192 1548288 39000 256-LFBGA


    General Description

    The Certus™-NX family of low-power general purpose FPGAs can be used in a wide range of applications across multiple

    markets, and are optimized for bridging and processing needs in Edge applications. It is built on the Lattice Nexus™ FPGA

    platform, using low-power 28nm FD-SOI technology. It combines the extreme flexibility of an FPGA with the low power

    and high reliability (due to extremely low SER) of FD-SOI technology, and offer small footprint package options with a high

    amount of I/O per mm2. Design security features such as AES-256 encryption and ECDSA authentication are also

    supported.

    Certus-NX supports a variety of interfaces including PCI Express (Gen1, Gen2), SGMII (Gigabit Ethernet), LVDS, LVCMOS

    (0.9–3.3 V), and more.

    Processing features of Certus-NX include up to 39k Logic Cells, 56 18 × 18 multipliers, 2.9 Mb of embedded memory

    (consisting of EBR and LRAM blocks), distributed memory, DRAM interfaces (supporting DDR3, DDR3L, LPDDR2, and

    LPDDR3 up to 1066 Mbps × 16 data width).

    Certus-NX FPGAs support fast configuration of its reconfigurable SRAM-based logic fabric, and ultra-fast configuration (in

    under 3 ms) of its programmable sysI/O™. In addition to the high reliability inherent to FD-SOI technology (due to its

    extremely low SER), active reliability features such as built-in frame-based SED/SEC (for SRAM-based logic fabric), and ECC

    (for EBR and LRAM) are also supported. Dual 12-bit ADCs are available on-chip for system monitoring functions.

    Lattice Radiant™ design software allows large complex user designs to be efficiently implemented on Certus-NX FPGA

    family. Synthesis library support for Certus-NX devices is available for popular logic synthesis tools. Radiant tools use the

    synthesis tool output along with constraints from its floor planning tools, to place and route the user design in Certus-NX

    device. The tools extract timing from the routing, and back-annotate it into the design for timing verification.

    Lattice provides many pre-engineered IP (Intellectual Property) modules for Certus-NX family. By using these configurable

    soft IP cores as standardized blocks, you are free to concentrate on the unique aspects of your design, increasing your

    productivity.


    Features

    • Programmable architecture

          17 k to 39 k logic cells

          24 to 56 18 × 18 multipliers (in sysDSP™ blocks)

          2.5 to 2.9 Mb of embedded memory blocks (EBR, LRAM)

          78 to 192 programmable sysI/O (High Performance and Wide Range I/O)

    • Programmable sysI/O supports wide variety of interfaces

          High Performance (HP) I/O on bottom I/O banks

                Supports up to 1.8 V VCCIO

                Mixed voltage support (1.0 V, 1.2 V, 1.5 V, 1.8 V)

                High-speed differential up to 1.5 Gbps

                Supports LVDS, Soft D-PHY (Tx/Rx), LVDS 7:1 (Tx/Rx), SLVS (Tx/Rx), subLVDS (Rx)

                Supports SGMII (Gb Ethernet) – 2 channels (Tx/Rx) at 1.25 Gbps

                Dedicated DDR3/DDR3L and LPDDR2/LPDDR3 memory support with DQS logic, up to 1066 Mbps data-rate and

                x16 data-width

          Wide Range (WR) I/O on left, right, and top I/O Bank

                Supports up to 3.3 V VCCIO

                Mixed voltage support (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V)

                Programmable slew rate (slow, med, fast*)

                Controlled impedance mode

                Emulated LVDS support

                Hot-socketing

    • Power modes – Low Power versus High Performance

          User selectable

          Low-Power mode for power and/or thermal challenges

          High-Performance mode for faster processing

    • Small footprint package options

          6 mm × 6 mm package option in both densities

    • 2x SGMII CDR at up to 1.25 Gbps – to support 2 channels SGMII using HP I/O

          CDR for RX

          10b/8b decoding

          Independent Loss of Lock (LOL) detector for each CDR block

    *Note: Except caBGA196.

    • sysCLOCK™ analog PLLs

          Three in 39k LC and two in 17k LC device

          Six outputs per PLL

          Fractional N

          Programmable and dynamic phase control

    • sysDSP enhanced DSP blocks

          Hardened pre-adder

          Dynamic shift for AI/ML support

          Four 18 × 18, eight 9 × 9, two 18 × 36, or 36 × 36 multipliers

          Advanced 18 × 36, two 18 × 18, or four 8 × 8 MAC

    • Flexible memory resources

          Up to 1.5 Mb sysMEM™ Embedded Block RAM (EBR)

          Programmable width

          ECC

          FIFO

          80k to 240k bits distributed RAM

          Large RAM Blocks

                0.5 Mbits per block

                Up to five blocks (2.5 Mb total) per device

    • SerDes – PCIe Gen2 x1 channel (Tx/Rx) hard IP in 39k LC device

          PCIe hard IP supports

                Gen1 and Gen2

                Endpoint and Root complex

                Multi-function up to four functions

                x1 lane

    • Internal bus interface support

          APB control bus

          AHB-Lite for data bus

          AXI4-streaming

    • Configuration – Fast, Secure

          SPI – x1, x2, x4 up to 150 MHz

                Master and Slave SPI support

          JTAG

          I2C and I3C

          Ultrafast I/O configuration for instant-on support

          Less than 15 ms full device configuration for LFD2NX-40

    • Cryptographic engine

          Bitstream encryption – using AES-256

          Bitstream authentication – using ECDSA

          Hashing algorithms – SHA, HMAC

          True Random Number Generator

          AES 128/256 Encryption

    • Single Event Upset (SEU) Mitigation Support

          Extremely low Soft Error Rate (SER) due to FD-SOI technology

          Soft Error Detect – Embedded hard macro

          Soft Error Correction – Without stopping user operation

          Soft Error Injection – Emulate SEU event to debug system error handling

    • ADC – 1 MSPS, 12-bit SAR

          Two ADCs per device

          Three Continuous-time Comparators

          Simultaneous sampling

    • System level support

          IEEE 1149.1 and IEEE 1532 compliant

          Reveal Logic Analyzer

          On-chip oscillator for initialization and general use

          1.0 V core power supply


    How to choose FPGA for your project?



                                                                



    PDF

    24
    256-LFBGA
    LFE2M70SE-6F900I
    ECP2M Field Programmable Gate Array (FPGA) IC 416 4642816 67000 900-BBGA
    8911
    900-BBGA
    LFE3-17EA-7LMG328I
    ECP3 Field Programmable Gate Array (FPGA) IC 116 716800 17000 328-LFBGA, CSBGA
    8417
    328-LFBGA, CSBGA
    LFE3-35EA-8LFN484C
    ECP3 Field Programmable Gate Array (FPGA) IC 295 1358848 33000 484-BBGA
    5357
    484-BBGA
    LFE3-70EA-8LFN672C
    ECP3 Field Programmable Gate Array (FPGA) IC 380 4526080 67000 672-BBGA
    1967
    672-BBGA
    LFSC3GA115E-5FF1704C
    SC Field Programmable Gate Array (FPGA) IC 942 7987200 115000 1704-BBGA, FCBGA
    1700
    1704-BBGA, FCBGA
    LFSC3GA25E-5F900C
    SC Field Programmable Gate Array (FPGA) IC 378 1966080 25000 900-BBGA
    6761
    900-BBGA
    LFSC3GA40E-6FFA1020C
    SC Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA
    6480
    1020-BBGA, FCBGA
    LFSCM3GA115EP1-5FF1704C
    SCM Field Programmable Gate Array (FPGA) IC 942 7987200 115000 1704-BBGA, FCBGA
    2403
    1704-BBGA, FCBGA
    LFSCM3GA25EP1-5F900C
    SCM Field Programmable Gate Array (FPGA) IC 378 1966080 25000 900-BBGA
    6540
    900-BBGA
    LFSCM3GA40EP1-6FFA1020C
    SCM Field Programmable Gate Array (FPGA) IC 562 4075520 40000 1020-BBGA, FCBGA
    1898
    1020-BBGA, FCBGA
    LFXP10E-3F388C
    XP Field Programmable Gate Array (FPGA) IC 244 221184 10000 388-BBGA
    8599
    388-BBGA
    LFXP15C-4F484I
    XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA
    4541
    484-BBGA
    LFXP20C-3F388C
    XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA
    9537
    388-BBGA
    LFXP20E-4F388C
    XP Field Programmable Gate Array (FPGA) IC 268 405504 20000 388-BBGA
    8769
    388-BBGA
    LFXP2-30E-6FT256C
    XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA
    6849
    256-LBGA
    LFXP2-5E-7FT256C
    XP2 Field Programmable Gate Array (FPGA) IC 172 169984 5000 256-LBGA
    5656
    256-LBGA
    LFXP3E-3T100I
    XP Field Programmable Gate Array (FPGA) IC 62 55296 3000 100-LQFP
    3686
    100-LQFP
    LFXP6C-4T144C
    XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP
    4868
    144-LQFP
    LFXP6E-5T144C
    XP Field Programmable Gate Array (FPGA) IC 100 73728 6000 144-LQFP
    4244
    144-LQFP
    ORT8850H-1BM680C
    ORCA® 4 Field Programmable Gate Array (FPGA) IC 297 151552 16192 680-BBGA
    4597
    680-BBGA
    ICE40HX1K-TQ144
    iCE40™ HX Field Programmable Gate Array (FPGA) IC 96 65536 1280 144-LQFP
    2
    144-LQFP
    LCMXO2-1200UHC-5FTG256I
    MachXO2 Field Programmable Gate Array (FPGA) IC 206 75776 1280 256-LBGA
    2884
    256-LBGA
    LCMXO2-1200HC-6TG144IR1
    MachXO2 Field Programmable Gate Array (FPGA) IC 107 65536 1280 144-LQFP
    3677
    144-LQFP
    LCMXO2-1200ZE-2MG132CR1
    MachXO2 Field Programmable Gate Array (FPGA) IC 104 65536 1280 132-LFBGA, CSPBGA
    2812
    132-LFBGA, CSPBGA
    ICE65L01F-TCB121C
    iCE65™ L Field Programmable Gate Array (FPGA) IC 92 65536 1280 121-VFBGA, CSBGA
    6115
    121-VFBGA, CSBGA
    ICE65L04F-LCB284I
    iCE65™ L Field Programmable Gate Array (FPGA) IC 176 81920 3520 284-VFBGA, CSPBGA
    6419
    284-VFBGA, CSPBGA

    Please send RFQ , we will respond immediately.

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