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Part Number
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Manufacturers
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Telecom IC 480-TBGA (37.5x37.5)
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1089
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480-LBGA Exposed Pad
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ARM® Cortex®-M4 Kinetis K60 Microcontroller IC 32-Bit Single-Core 100MHz 512KB (512K x 8) FLASH 121-MAPBGA (8x8)
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2836
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121-LFBGA
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S08 S08 Microcontroller IC 8-Bit 40MHz 16KB (16K x 8) FLASH 48-LQFP (7x7)
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5078
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48-LQFP
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ARM® Cortex®-M4F S32K Microcontroller IC 32-Bit Single-Core 80MHz 512KB (512K x 8) FLASH 64-LQFP (10x10)
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2858
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64-LQFP
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e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 3MB (3M x 8) FLASH 256-MAPPBGA (17x17)
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6134
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256-LBGA
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Bipolar (BJT) Transistor
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5
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HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 96KB (96K x 8) FLASH 48-LQFP (7x7) Introduction The MC9S12C-Family / MC9S12GC-Family are 48/52/80 pin Flash-based MCU families, which deliver the power and flexibility of the 16-bit core to a whole new range of cost and space sensitive, general purpose industrial and automotive network applications. All MC9S12C-Family / MC9S12GC-Family members feature standard on-chip peripherals including a 16-bit central processing unit (CPU12), up to 128K bytes of Flash EEPROM, up to 4K bytes of RAM, an asynchronous serial communications interface (SCI), a serial peripheral interface (SPI), an 8-channel 16-bit timer module (TIM), a 6-channel 8-bit pulse width modulator (PWM), an 8-channel, 10-bit analog-to-digital converter (ADC). The MC9S12C128-Family members also feature a CAN 2.0 A, B software compatible module (MSCAN12). All MC9S12C-Family / MC9S12GC-Family devices feature full 16-bit data paths throughout. The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit operational requirements. In addition to the I/O ports available in each module, up to 10 dedicated I/O port bits are available with wake-up capability from stop or wait mode. The devices are available in 48-, 52-, and 80- pin QFP packages, with the 80-pin version pin compatible to the HCS12 A, B, and D Family derivatives Features • 16-bit HCS12 core: — HCS12 CPU – Upward compatible with M68HC11 instruction set – Interrupt stacking and programmer’s model identical to M68HC11 – Instruction queue – Enhanced indexed addressing — MMC (memory map and interface) — INT (interrupt control) — BDM (background debug mode) — DBG12 (enhanced debug12 module, including breakpoints and change-of-flow trace buffer) — MEBI (multiplexed expansion bus interface) available only in 80-pin package version • Wake-up interrupt inputs: — Up to 12 port bits available for wake up interrupt function with digital filtering • Memory options: — 16K or 32Kbyte Flash EEPROM (erasable in 512-byte sectors) 64K, 96K, or 128Kbyte Flash EEPROM (erasable in 1024-byte sectors) — 1K, 2K or 4K Byte RAM • Analog-to-digital converters: — One 8-channel module with 10-bit resolution — External conversion trigger capability • Available on MC9S12C Family: — One 1M bit per second, CAN 2.0 A, B software compatible module — Five receive and three transmit buffers — Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit — Four separate interrupt channels for Rx, Tx, error, and wake-up — Low-pass filter wake-up function — Loop-back for self test operation • Timer module (TIM): — 8-channel timer — Each channel configurable as either input capture or output compare — Simple PWM mode — Modulo reset of timer counter — 16-bit pulse accumulator — External event counting — Gated time accumulation • PWM module: — Programmable period and duty cycle — 8-bit 6-channel or 16-bit 3-channel — Separate control for each pulse width and duty cycle — Center-aligned or left-aligned outputs — Programmable clock select logic with a wide range of frequencies — Fast emergency shutdown input • Serial interfaces: — One asynchronous serial communications interface (SCI) — One synchronous serial peripheral interface (SPI) • CRG (clock reset generator module) — Windowed COP watchdog — Real time interrupt — Clock monitor — Pierce or low current Colpitts oscillator — Phase-locked loop clock frequency multiplier — Limp home mode in absence of external clock — Low power 0.5MHz to 16MHz crystal oscillator reference clock • Operating frequency: — 32MHz equivalent to 16MHz bus speed for single chip — 32MHz equivalent to 16MHz bus speed in expanded bus modes — Option of 9S12C Family: 50MHz equivalent to 25MHz bus speed — All 9S12GC Family members allow a 50MHz operating frequency. • Internal 2.5V regulator: — Supports an input voltage range from 2.97V to 5.5V — Low power mode capability — Includes low voltage reset (LVR) circuitry — Includes low voltage interrupt (LVI) circuitry • 48-pin LQFP, 52-pin LQFP, or 80-pin QFP package: — Up to 58 I/O lines with 5V input and drive capability (80-pin package) — Up to 2 dedicated 5V input only lines (IRQ, XIRQ) — 5V 8 A/D converter inputs and 5V I/O • Development support: — Single-wire background debug™ mode (BDM) — On-chip hardware breakpoints — Enhanced DBG12 debug features NXP Electronics components unboxing,humidity card changed color chip can used? |
6757
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48-LQFP
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HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 80-QFP (14x14)
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1139
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80-QFP
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RF Mosfet 28 V 1.2 A 880MHz 20.9dB 35W NI-780S
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1010
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NI-780S
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RS08 RS08 Microcontroller IC 8-Bit 20MHz 8KB (8K x 8) FLASH 16-TSSOP
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9578
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16-TSSOP (0.173", 4.40mm Width)
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I/O Expander 16 I²C, SMBus 400 kHz 24-HWQFN (4x4)
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2932
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24-WFQFN Exposed Pad
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e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 3MB (3M x 8) FLASH 100-MAPBGA (11x11)
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5361
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100-LFBGA
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ARM® Cortex®-M4F S32K Microcontroller IC 32-Bit Single-Core 80MHz 2MB (2M x 8) FLASH 144-LQFP (20x20)
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4737
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144-LQFP
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Mosfet Array
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17
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Diode Array 3 Independent 200 V 200mA (DC) Surface Mount SC-74, SOT-457
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5368
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SC-74, SOT-457
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S12Z S12 MagniV Microcontroller IC 16-Bit 32MHz 32KB (32K x 8) FLASH 32-HVQFN (5x5) Introduction The MC9S12ZVL-Family is an automotive 16-bit microcontroller family using the 180nm NVM+UHV technology that offers the capability to integrate 40V analog components. This family reuses many features from the existing S12 portfolio. The particular differentiating features of this family are the enhanced S12Z core and the integration of“high-voltage”analog modules, including the voltage regulator (VREG) and a Local Interconnect Network (LIN) physical layer. The MC9S12ZVL-Family includes error correction code (ECC) on RAM, FLASH and EEPROM for diagnostic or data storage, a fast analog-to-digital converter (ADC) and a frequency modulated phase locked loop (IPLL) that improves the EMC performance. The MC9S12ZVL-Family delivers an optimized solution with the integration of several key system components into a single device, optimizing system architecture and achieving significant space savings.TheMC9S12ZVL-Family delivers all the advantages and efficiencies ofa 16-bit MCU while retaining the low cost, power consumption, EMC, and code-size efficiency advantages currently enjoyed by users of existing S12 families. The MC9S12ZVL-Family is available in 48-pin, 32-pin LQFPand 32-pin QFN-EP. In addition to the I/O ports available in each module, further I/O ports are available with interrupt capability allowing wake-up from stop or wait modes. The MC9S12ZVL-Family is a general-purpose family of devices suitable for a wide range of applications. The MC9S12ZVL-Family is targeted at generic automotive applications requiring LIN connectivity. Typical examples of these applications include switch panels and body endpoints for sensors. Chip-Level Features On-chip modules available within the family include the following features: ·S12Z CPU core ·128, 96, 64, 32, 16 or 8 KB on-chip flash with ECC ·2048,1024, 128 byte EEPROM with ECC ·8192, 4096, 1024 or 512 byte on-chip SRAM with ECC ·Phase locked loop (IPLL) frequency multiplier with internal filter ·1MHz internal RC oscillator with+/-1.3% accuracy over rated temperature range ·4-20 MHz amplitude controlled pierce oscillator ·Internal COP (watchdog) module ·analog-to-digital converter (ADC) with 10-bit or 12-bit resolution and up to 10 channels available on external pins and Vbg(bandgap) result reference ·PGA module with two input channels ·One 8-bit 5V digital-to-analog converter (DAC) ·One analog comparators (ACMP) with rail-to-rail inputs ·MSCAN (1 Mbit/s, CAN 2.0 A, B software compatible) module ·One serial peripheral interface (SPI) module ·One serial communication interface (SCI) module with interface to internal LIN physical layer transceiver (with RX connected to a timer channel for frequency calibration purposes, if desired) ·Up to one additional SCI (not connected to LIN physical layer) ·One on-chip LIN physical layer transceiver fully compliant with the LIN 2.2 standard ·6-channel timer module (TIM0) with input capture/output compare ·2-channel timer module (TIM1) with input capture/output compare ·Inter-IC (IIC) module ·8-channel Pulse Width Modulation module (PWM) ·On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages ·Autonomous periodic interrupt (API), supports cyclic wakeup from Stop mode ·Pins to support 25 mA drive strength to VSSX ·Pin to support 20 mA drive strength from VDDX (EVDD) ·High Voltage Input (HVI) ·Supply voltage sense with low battery warning ·On-chip temperature sensor, temperature value can be measured with ADC or can generate a high temperature warning ·Up to 23 pins can be used as keyboard wake-up interrupt (KWI) |
4435
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32-VFQFN Exposed Pad
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Amplifier IC 1-Channel (Mono) Class AB 8-HVSON (4x4)
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2860
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8-VDFN Exposed Pad
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DSP 16BIT W/DDR CTRLR 400-MAPBGA
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6154
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400-LFBGA
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S08 S08 Microcontroller IC 8-Bit 40MHz 48KB (48K x 8) FLASH 32-LQFP (7x7)
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9405
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32-LQFP
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N-Channel 60 V 58A (Tc) 96W (Tc) Through Hole TO-220AB
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8448
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TO-220-3
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e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 3MB (3M x 8) FLASH 256-MAPPBGA (17x17)
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5226
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256-LBGA
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Embedded Systems, Low-Power IoT, Mobile/Wearable Devices PMIC 40-HVQFN (5x5)
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5018
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40-VFQFN Exposed Pad
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D-Type Transparent Latch 2 Channel 8:8 IC Tri-State 48-SSOP
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10
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48-BSSOP (0.295", 7.50mm Width)
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ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)
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8342
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529-FBGA
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S12 S/MM9 Microcontroller IC 16-Bit 20MHz 32KB (32K x 8) FLASH 48-HLQFP (7x7) Integrated S12 Based Relay Driver with LIN The S/MM912F634 is an integrated single package solution integrating an HCS12 microcontroller with a SMARTMOS analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application specific functions, including a LIN transceiver. Features • 16-Bit S12 CPU, 32 kByte FLASH, 2.0 kByte RAM • Background debug (BDM) & debug module (DBG) • Die to die bus interface for transparent memory mapping • On-chip oscillator & two independent watchdogs • LIN 2.1 physical layer interface with integrated SCI • Six digital MCU GPIOs shared with SPI (PA5…0) • 10-Bit, 15 channel - analog to digital converter (ADC) • 16-Bit, four channel - timer module (TIM16B4C) • 8-Bit, two channel - pulse width modulation module (PWM) • Six high-voltage / wake-up inputs (L5.0) • Three low-voltage GPIOs (PB2.0) • Low-power modes with cyclic sense & forced wake-up • Current sense module with selectable gain • Reverse battery protected voltage sense module • Two protected low-side outputs to drive inductive loads • Two protected high-side outputs • Chip temperature sensor • Hall sensor supply • Integrated voltage regulator(s) NXP Electronics components unboxing,humidity card changed color chip can used? |
2788
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48-LQFP Exposed Pad
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S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 64-QFP (14x14)
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3791
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64-QFP
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DSP 16BIT 275MHZ CPM 332FCBGA
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5911
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332-BFBGA, FCBGA
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S08 S08 Microcontroller IC 8-Bit 40MHz 128KB (128K x 8) FLASH 48-LQFP (7x7)
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4701
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48-LQFP
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N-Channel 60 V 54A (Tc) 96W (Tc) Through Hole I2PAK
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8789
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TO-262-3 Long Leads, I²Pak, TO-262AA
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e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 4MB (4M x 8) FLASH 176-LQFP (24x24)
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3124
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176-LQFP Exposed Pad
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