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    A Comprehensive Guide To S912ZVCA96F0MKH Microcontroller IC 16-bit 32MHz 96KB(96K x 8) Flash 64-LQFP(10x10)

    S12Z S12 MagniV Microcontroller IC 16-bit 32MHz 96KB(96K x 8) Flash 64-LQFP(10x10)


    Introduction

    The MC9S12ZVC-Family is a new member of the S12 MagniV product line integrating a battery level

    (12V) voltage regulator, supply voltage monitoring, high voltage inputs and a CAN physical interface. It's

    primarily targeting at CAN nodes like sensors, switch panels or small actuators. It offers various

    low-power modes and wakeup management to address state of the art power consumption requirements.

    Some members of the MC9S12ZVC-Family are also offered for high temperature applications requiring

    AEC-Q100 Grade 0 (-40℃ to +150C ambient operating temperature range).

    The MC9S12ZVC-Family is based on the enhanced performance, linear address space S12Z core and

    delivers an optimized solution with the integration of several key system components into a single device,

    optimizing system architecture and achieving significant space savings.


    Chip-Level Features

    On-chip modules available within the family include the following features:

    •S12Z CPU core

    •Up to 192 Kbyte on-chip flash with ECC

    •Up to 2 Kbyte EEPROM with ECC

    •Up to 12Kbyte on-chip SRAM with ECC

    •Phase locked loop (IPLL) frequency multiplier with internal filter

    •1 MHz internalRC oscillator with +/-1.3% accuracy over rated temperature range

    •4-20MHz amplitude controlled pierce oscillator

    •Internal COP(watchdog) module

    •Analog-to-digital converter (ADC) with 12-bit resolution and up to 16 channels available on

    external pins

    •Two analog comparators (ACMP) with rail-to-rail inputs

    •One 8-bit 5V digital-to-analog converter (DAC)

    •Up to two serial peripheral interface (SPI) modules

    •Up to two serial communication interface (SCI) modules

    •SENT Transmitter Interface

    •MSCAN(1 Mbit/s,CAN 2.0 A, B software compatible) module

    •One on-chip CAN physical layer module

    •8-channel timer module (TIM0) with input capture/output compare

    •4-channel timer module (TIM1) with input capture/output compare (fast max 64MHz)

    •Inter-IC (IIC) module

    •4-channel 16-bit Pulse Width Modulation module (PWM0)

    •4-channel 16-bit Pulse Width Modulation module (PWM1) (fast max 64MHz)

    •On-chip voltage regulator(VREG) for regulation of input supply and all internal voltages

    •Autonomous periodic interrupt (API), supports cyclic wakeup from Stop mode

    •Four pins to support 25 mA drive strength to VSSX

    •One pin to support 20 mA drive strength fromVDDX (EVDD)

    •Two High Voltage Input(HVI) pins

    •Supply Vsup monitoring with warning

    •On-chip temperature sensor, temperature value can be measured with ADC or can generate a high

    temperature interrupt


    6839
    64-LQFP(10x10)
    MC9S12DJ128CPVE
    HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 112-LQFP (20x20)
    1568
    112-LQFP
    MRFG35003NT1
    RF Mosfet 12 V 55 mA 3.55GHz 11.5dB 3W PLD-1.5
    8936
    PLD-1.5
    MC9S08AC32CFGER
    S08 S08 Microcontroller IC 8-Bit 40MHz 32KB (32K x 8) FLASH 44-LQFP (10x10)
    5481
    44-LQFP
    SCC2691AE1A28,512
    UART IC 1, UART Channel 28-PLCC (11.48x11.48)
    6517
    28-LCC (J-Lead)
    SPC5746BK1MMJ6R
    e200z4 MPC57xx Microcontroller IC 32-Bit Single-Core 160MHz 3MB (3M x 8) FLASH 256-MAPPBGA (17x17)
    3103
    256-LBGA
    FS32K148HRT0VLUT
    ARM® Cortex®-M4F S32K Microcontroller IC 32-Bit Single-Core 80MHz 2MB (2M x 8) FLASH 176-LQFP (24x24)
    7466
    176-LQFP
    74HCT4053DB,112
    Circuit IC Switch
    5030
    74HC125D,653
    Buffer, Non-Inverting 4 Element 1 Bit per Element 3-State Output 14-SO
    6513
    14-SOIC (0.154", 3.90mm Width)
    A Comprehensive Guide To S9S12GN32F0CLFR Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 48-LQFP (7x7)

    12V1 HCS12 Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 48-LQFP (7x7)


    Introduction

    The MC9S12G-Family is an optimized, automotive, 16-bit microcontroller product line focused on

    low-cost, high-performance, and low pin-count. This family is intended to bridge between high-end 8-bit

    microcontrollers and high-performance 16-bit microcontrollers, such as the MC9S12XS-Family. The

    MC9S12G-Family is targeted at generic automotive applications requiring CAN or LIN/J2602

    communication. Typical examples of these applications include body controllers, occupant detection, door

    modules, seat controllers, RKE receivers, smart actuators, lighting modules, and smart junction boxes.

    The MC9S12G-Family uses many of the same features found on the MC9S12XS- and MC9S12P-Family,

    including error correction code (ECC) on flash memory, a fast analog-to-digital converter (ADC) and a

    frequency modulated phase locked loop (IPLL) that improves the EMC performance. 

    The MC9S12G-Family is optimized for lower program memory sizes down to 16k. In order to simplify

    customer use it features an EEPROM with a small 4 bytes erase sector size.

    The MC9S12G-Family deliver all the advantages and efficiencies of a 16-bit MCU while retaining the low

    cost, power consumption, EMC, and code-size efficiency advantages currently enjoyed by users of NXP’s

    existing 8-bit and 16-bit MCU families. Like the MC9S12XS-Family, the MC9S12G-Family run 16-bit

    wide accesses without wait states for all peripherals and memories. The MC9S12G-Family is available in

    100-pin LQFP, 64-pin LQFP, 48-pin LQFP/QFN, 32-pin LQFP and 20-pin TSSOP package options and

    aims to maximize the amount of functionality especially for the lower pin count packages. In addition to

    the I/O ports available in each module, further I/O ports are available with interrupt capability allowing

    wake-up from stop or wait modes.

     

    Chip-Level Features

    On-chip modules available within the family include the following features:

    • S12 CPU core

    • Up to 240 Kbyte on-chip flash with ECC

    • Up to 4 Kbyte EEPROM with ECC

    • Up to 11 Kbyte on-chip SRAM

    • Phase locked loop (IPLL) frequency multiplier with internal filter

    • 4–16 MHz amplitude controlled Pierce oscillator

    • 1 MHz internal RC oscillator

    • Timer module (TIM) supporting up to eight channels that provide a range of 16-bit input capture,

    output compare, counter, and pulse accumulator functions

    • Pulse width modulation (PWM) module with up to eight x 8-bit channels

    • Up to 16-channel, 10 or 12-bit resolution successive approximation analog-to-digital converter

    (ADC)

    • Up to two 8-bit digital-to-analog converters (DAC)

    • Up to one 5V analog comparator (ACMP)

    • Up to three serial peripheral interface (SPI) modules

    • Up to three serial communication interface (SCI) modules supporting LIN communications

    • Up to one multi-scalable controller area network (MSCAN) module (supporting CAN protocol

    2.0A/B)

    • On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages

    • Autonomous periodic interrupt (API)

    • Precision fixed voltage reference for ADC conversions

    • Optional reference voltage attenuator module to increase ADC accuracy


    5526
    48-LQFP
    MC908QB8MDWE
    HC08 HC08 Microcontroller IC 8-Bit 8MHz 8KB (8K x 8) FLASH 16-SOIC
    3053
    16-SOIC (0.295", 7.50mm Width)
    MSC7116VM1000
    DSP 16BIT W/DDR CTRLR 400-MAPBGA
    6782
    400-LFBGA
    MC9S08AC96MFGE
    S08 S08 Microcontroller IC 8-Bit 40MHz 96KB (96K x 8) FLASH 44-LQFP (10x10)
    6758
    44-LQFP
    BUK951R6-30E,127
    N-Channel 30 V 120A (Tc) 349W (Tc) Through Hole TO-220AB
    8592
    TO-220-3
    SPC5747CK1CMJ2
    e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/120MHz 4MB (4M x 8) FLASH 256-MAPPBGA (17x17)
    8188
    256-LBGA
    MC9S08PA4AVTJ
    S08 S08 Microcontroller IC 8-Bit 20MHz 4KB (4K x 8) FLASH 20-TSSOP
    7057
    20-TSSOP (0.173", 4.40mm Width)
    74HC4060DB,112
    Counter IC Binary Counter 1 Element 14 Bit Negative Edge 16-SSOP
    3820
    16-SSOP (0.209", 5.30mm Width)
    PMBT3946YPN,125
    Bipolar (BJT) Transistor Array NPN, PNP 40V 200mA 300MHz, 250MHz 350mW Surface Mount SOT-363
    3715
    6-TSSOP, SC-88, SOT-363
    A Comprehensive Guide To S912XD256F1CAAR Microcontroller IC 16-Bit 80MHz 256KB (256K x 8) FLASH 80-QFP (14x14)

    HCS12X HCS12X Microcontroller IC 16-Bit 80MHz 256KB (256K x 8) FLASH 80-QFP (14x14)


    Introduction

    The MC9S12XD family will retain the low cost, power consumption, EMC and code-size efficiency

    advantages currently enjoyed by users of Freescale's existing 16-Bit MC9S12 MCU Family.

    Based around an enhanced S12 core, the MC9S12XD family will deliver 2 to 5 times the performance of

    a 25-MHz S12 whilst retaining a high degree of pin and code compatibility with the S12.

    The MC9S12XD family introduces the performance boosting XGATE module. Using enhanced DMA

    functionality, this parallel processing module offloads the CPU by providing high-speed data processing

    and transfer between peripheral modules, RAM, Flash EEPROM and I/O ports. Providing up to 80 MIPS

    of performance additional to the CPU, the XGATE can access all peripherals, Flash EEPROM and the

    RAM block.

    The MC9S12XD family is composed of standard on-chip peripherals including up to 512 Kbytes of Flash

    EEPROM, 32 Kbytes of RAM, 4 Kbytes of EEPROM, six asynchronous serial communications interfaces

    (SCI), three serial peripheral interfaces (SPI), an 8-channel IC/OC enhanced capture timer, an 8-channel,

    10-bit analog-to-digital converter, a 16-channel, 10-bit analog-to-digital converter, an 8-channel

    pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two

    inter-IC bus blocks, and a periodic interrupt timer. The MC9S12XD family has full 16-bit data paths

    throughout.

    The non-multiplexed expanded bus interface available on the 144-pin versions allows an easy interface to

    external memories

    The inclusion of a PLL circuit allows power consumption and performance to be adjusted to suit

    operational requirements. System power consumption can be further improved with the new “fast exit from

    stop mode” feature.

    In addition to the I/O ports available in each module, up to 25 further I/O ports are available with interrupt

    capability allowing wake-up from stop or wait mode.

    Family members in 144-pin LQFP will be available with external bus interface and parts in 112-pin LQFP

    or 80-pin QFP package without external bus interface. See Appendix E Derivative Differencesfor package

    options.


    MC9S12XD/B/A Family Features

    • HCS12X Core

    — 16-bit HCS12X CPU

    – Upward compatible with MC9S12 instruction set

    – Interrupt stacking and programmer’s model identical to MC9S12

    – Instruction queue

    – Enhanced indexed addressing

    – Enhanced instruction set

    — EBI (external bus interface)

    — MMC (module mapping control)

    — INT (interrupt controller)

    — DBG (debug module to monitor HCS12X CPU and XGATE bus activity)

    — BDM (background debug mode)

    • XGATE (peripheral coprocessor)

    — Parallel processing module off loads the CPU by providing high-speed data processing and

    transfer

    — Data transfer between Flash EEPROM, RAM, peripheral modules, and I/O ports

    • PIT (periodic interrupt timer)

    — Four timers with independent time-out periods

    — Time-out periods selectable between 1 and 224 bus clock cycles

    • CRG (clock and reset generator)

    — Low noise/low power Pierce oscillator

    — PLL

    — COP watchdog

    — Real time interrupt

    — Clock monitor

    — Fast wake-up from stop mode

    • Port H & Port J with interrupt functionality

    — Digital filtering

    — Programmable rising or falling edge trigger

    • Memory

    — 512, 256 and 128-Kbyte Flash EEPROM

    — 4 and 2-Kbyte EEPROM

    — 32, 16 and 12-Kbyte RAM

    • One 16-channel and one 8-channel ADC (analog-to-digital converter)

    — 10-bit resolution

    — External and internal conversion trigger capabilityFiveFourTwo 1M bit per second,

    CAN 2.0 A, B software compatible modules

    — Five receive and three transmit buffers

    — Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit

    — Four separate interrupt channels for Rx, Tx, error, and wake-up

    — Low-pass filter wake-up function

    — Loop-back for self-test operation

    • ECT (enhanced capture timer)

    — 16-bit main counter with 7-bit prescaler

    — 8 programmable input capture or output compare channels

    — Four 8-bit or two 16-bit pulse accumulators

    • 8 PWM (pulse-width modulator) channels

    — Programmable period and duty cycle

    — 8-bit 8-channel or 16-bit 4-channel

    — Separate control for each pulse width and duty cycle

    — Center-aligned or left-aligned outputs

    — Programmable clock select logic with a wide range of frequencies

    — Fast emergency shutdown input

    • Serial interfaces

    — SixFourTwo asynchronous serial communication interfaces (SCI) with additional LIN support

    and selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse width

    — ThreeTwo Synchronous Serial Peripheral Interfaces (SPI)

    • TwoOne IIC (Inter-IC bus) Modules

    — Compatible with IIC bus standard

    — Multi-master operation

    — Software programmable for one of 256 different serial clock frequencies

    • On-Chip Voltage Regulator

    — Two parallel, linear voltage regulators with bandgap reference

    — Low-voltage detect (LVD) with low-voltage interrupt (LVI)

    — Power-on reset (POR) circuit

    — 3.3-V–5.5-V operation

    — Low-voltage reset (LVR)

    — Ultra low-power wake-up timer

    • 144-pin LQFP, 112-pin LQFP, and 80-pin QFP packages

    — I/O lines with 5-V input and drive capability

    — Input threshold on external bus interface inputs switchable for 3.3-V or 5-V operation

    — 5-V A/D converter inputs

    — Operation at 80 MHz equivalent to 40-MHz bus speed

    • Development support

    — Single-wire background debug™ mode (BDM)

    — Four on-chip hardware breakpoints


    NXP Electronics components unboxing,humidity card changed color chip can used?




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    6130
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    MC9S08DV16CLCR
    S08 S08 Microcontroller IC 8-Bit 40MHz 16KB (16K x 8) FLASH 32-LQFP (7x7)
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    7902
    TO-262-3 Long Leads, I²Pak, TO-262AA
    SPC5747GK1MKU6R
    e200z2, e200z4, e200z4 MPC57xx Microcontroller IC 32-Bit Tri-Core 80MHz/160MHz 4MB (4M x 8) FLASH 176-LQFP (24x24)
    1217
    176-LQFP Exposed Pad
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    A Comprehensive Guide To MC56F8256MLF Microcontroller IC 16-Bit 60MHz 64KB (32K x 16) FLASH 48-LQFP (7x7)

    56800E 56F8xxx Microcontroller IC 16-Bit 60MHz 64KB (32K x 16) FLASH 48-LQFP (7x7)


    Introduction

    The MC56F825x/MC56F824x is a member of Freescale’s family of digital signal controllers (DSCs)

    based on the 56800E core. It combines, on a single chip, DSP processing power and microcontroller

    functionality with a flexible set of peripherals, creating a cost-effective solution. Because of its low cost, 

    configuration flexibility, and compact program code, it is well-suited for many consumer and industrial 

    applications, including:

    • Industrial control

    • Home appliances

    • Smart sensors

    • Fire and security systems

    • Solar inverters

    • Battery chargers and management

    • Switched-mode power supplies and management

    • Power metering

    • Motor control (ACIM, BLDC, PMSM, SR, and stepper)

    • Handheld power tools

    • Arc detection

    • Medical devices/equipment

    • Instrumentation

    • Lighting ballast

    The 56800E core is based on a dual Harvard-style architecture consisting of three execution units

    operating in parallel, allowing as many as six operations per instruction cycle. The MCU-style

    programming model and optimized instruction set allow straightforward generation of efficient, compact

    DSP and control code. The instruction set is also highly efficient for C compilers to enable rapid

    development of optimized control applications.

    The MC56F825x/MC56F824x supports program execution from internal memories. Two data operands

    per instruction cycle can be accessed from the on-chip data RAM. A full set of programmable peripherals

    supports various applications. Each peripheral can be independently shut down to save power. Any pin

    except power pins can also be configured as General Purpose Input/Output (GPIO).


    Chip-level features

    On-chip features include:

    • 60 MHz operation frequency

    • DSP and MCU functionality in a unified, C-efficient architecture

    • On-chip memory

    — 56F8245/46: 48 KB (24K  16) flash memory; 6 KB (3K  16) unified data/program RAM

    — 56F8247: 48 KB (24K  16) flash memory; 8 KB (4K  16) unified data/program RAM

    — 56F8255/56/57: 64 KB (32K  16) flash memory; 8 KB (4K  16) unified data/program RAM

    • eFlexPWM with up to 9 channels, including 6 channels with high (520 ps) resolution NanoEdge

    placement

    • Two 8-channel, 12-bit analog-to-digital converters (ADCs)

    — Dynamic 2 and 4 programmable amplifier

    — Conversion time as short as 600 ns

    — Input current-injection protection

    • Three analog comparators with integrated 5-bit DAC references

    • Cyclic redundancy check (CRC) generator

    • Two high-speed queued serial communication interface (QSCI) modules with LIN slave

    functionality

    • Queued serial peripheral interface (QSPI) module

    • Two SMBus-compatible inter-integrated circuit (I2C) ports

    • Freescale’s scalable controller area network (MSCAN) 2.0 A/B module

    • Two 16-bit quad timers (2  4 16-bit timers)

    • Computer operating properly (COP) watchdog module

    • On-chip relaxation oscillator: 8 MHz (400 kHz at standby mode)

    • Crystal/resonator oscillator

    • Integrated power-on reset (POR) and low-voltage interrupt (LVI) and brown-out reset module

    • Inter-module crossbar connection

    • Up to 54 GPIOs

    • 44-pin LQFP, 48-pin LQFP, and 64-pin LQFP packages

    • Single supply: 3.0 V to 3.6 V


    NXP Electronics components unboxing,humidity card changed color chip can used?




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