Microsemi Corporation

Fusion® Field Programmable Gate Array (FPGA) IC 60 27648 180-WFQFN Dual Rows, Exposed Pad

General Description

The Fusion family, based on the highly successful ProASIC®3 and ProASIC3E flash FPGA architecture,has been designed

as a high-performance, programmable, mixed signal platform. By combining anadvanced flash FPGA core with flash

memory blocks and analog peripherals, Fusion devicesdramatically simplify system design and, as a result, dramatically

reduce overall system cost and boardspace.

The state-of-the-art flash memory technology offers high-density integrated flash memory blocks,enabling savings in

cost, power, and board area relative to external flash solutions, while providingincreased flexibility and performance. The

flash memory blocks and integrated analog peripherals enabletrue mixed-mode programmable logic designs. Two

examples are using an on-chip soft processor toimplement a fully functional flash MCU and using high-speed FPGA logic

to offer system and powersupervisory capabilities. Instant On, and capable of operating from a single 3.3 V supply, the

Fusionfamily is ideally suited for system management and control applications.

The devices in the Fusion family are categorized by FPGA core density. Each family member containsmany peripherals,

including flash memory blocks, an analog-to-digital-converter (ADC), high-driveoutputs, both RC and crystal oscillators,

and a real-time counter (RTC). This provides the user with ahigh level of flexibility and integration to support a wide

variety of mixed signal applications. The flashmemory block capacity ranges from 2 Mbits to 8 Mbits. The integrated

12-bit ADC supports up to 30independently configurable input channels. 

The on-chip crystal and RC oscillators work in conjunction with the integrated phase-locked loops (PLLs)to provide

clocking support to the FPGA array and on-chip resources. In addition to supporting typicalRTC uses such as watchdog

timer, the Fusion RTC can control the on-chip voltage regulator to powerdown the device (FPGA fabric, flash memory

block, and ADC), enabling a low power standby mode.

The Fusion family offers revolutionary features, never before available in an FPGA. The nonvolatile flashtechnology gives

the Fusion solution the advantage of being a highly secure, low power, single-chipsolution that is Instant On. Fusion is

reprogrammable and offers time-to-market benefits at an ASIC-levelunit cost. These features enable designers to create

high-density systems using existing ASIC or FPGAdesign flows and tools.

Features and Benefits

• High-Performance Reprogrammable FlashTechnology

      Advanced 130-nm, 7-Layer Metal, Flash-Based CMOSProcess

      Nonvolatile, Retains Program when Powered Off

      Instant On Single-Chip Solution

      350 MHz System Performance

• Embedded Flash Memory

      User Flash Memory–2 Mbits to 8 Mbits

      – Configurable 8-, 16-, or 32-Bit Datapath

      – 10 ns Access in Read-Ahead Mode

      1 Kbit of Additional FlashROM

• Integrated A/D Converter (ADC) and Analog I/O

      Up to 12-Bit Resolution and up to 600 Ksps

      Internal 2.56 V or External Reference Voltage

      ADC: Up to 30 Scalable Analog Input Channels

      High-Voltage Input Tolerance: –10.5 V to +12 V

      Current Monitor and Temperature Monitor Blocks

      Up to 10 MOSFET Gate Driver Outputs

      – P- and N-Channel Power MOSFET Support

      – Programmable 1, 3, 10, 30 µA, and 20 mA DriveStrengths

      ADC Accuracy is Better than 1%

• On-Chip Clocking Support

      Internal 100 MHz RC Oscillator (accurate to 1%)

      Crystal Oscillator Support (32 KHz to 20 MHz)

      Programmable Real-Time Counter (RTC)

      6 Clock Conditioning Circuits (CCCs) with 1 or 2 Integrated PLLs

      – Phase Shift, Multiply/Divide, and Delay Capabilities

      – Frequency: Input 1.5–350 MHz, Output 0.75–350 MHz

• Low Power Consumption

      Single 3.3 V Power Supply with On-Chip 1.5 V Regulator

      Sleep and Standby Low-Power Modes

• In-System Programming (ISP) and Security

      ISP with 128-Bit AES via JTAG

      FlashLock® Designed to Protect FPGA Contents

• Advanced Digital I/O

      1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation

      Bank-Selectable I/O Voltages – Up to 5 Banks per Chip

      Single-Ended I/O Standards: LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V,3.3V PCI/3.3V PCI-X, and LVCMOS 2.5V/5.0 V Input

      Differential I/O Standards: LVPECL, LVDS, B-LVDS,M-LVDS

      – Built-In I/O Registers

      – 700 Mbps DDR Operation

      Hot-Swappable I/Os

      Programmable Output Slew Rate, Drive Strength, and Weak Pull-Up/Down Resistor

      Pin-Compatible Packages across the Fusion® FamilySRAMs and FIFOs

      Variable-Aspect-Ratio 4,608-Bit SRAM Blocks (×1, ×2,×4, ×9, and ×18 organizations available)

      True Dual-Port SRAM (except ×18)

      Programmable Embedded FIFO Control Logic

• Soft ARM Cortex-M1 Fusion Devices (M1)

      ARM® Cortex-™M1–Enabled

• Pigeon Point ATCA IP Support (P1)

      Targeted to Pigeon Point® Board ManagementReference (BMR) Starter Kits

      Designed in Partnership with Pigeon Point Systems

      ARM Cortex-M1 Enabled

• MicroBlade Advanced Mezzanine Card Support (U1)

      Targeted to Advanced Mezzanine Card (AdvancedMC™Designs)

      Designed in Partnership with MicroBlade

      8051-Based Module Management Controller (MMC)

How to choose FPGA for your project?

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