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Manufacturers
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Microprocessor IC *
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7893
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HC05 HC05 Microcontroller IC 8-Bit 2.1MHz 4.5KB (4.5K x 8) OTP 28-SOIC
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2097
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28-SOIC (0.295", 7.50mm Width)
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MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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2575
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357-BBGA
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PowerPC e300c4s Microprocessor IC MPC83xx 1 Core, 32-Bit 667MHz 689-TEPBGA II (31x31)
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2021
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689-BBGA Exposed Pad
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ARM® Cortex®-M0 LPC1100L Microcontroller IC 32-Bit Single-Core 50MHz 16KB (16K x 8) FLASH 20-TSSOP
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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3343
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20-TSSOP (0.173
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USB Switch IC Channel 40-VFBGA (4.75x3.25)
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5578
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40-VFBGA
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12V1 HCS12 Microcontroller IC 16-Bit 25MHz 32KB (32K x 8) FLASH 20-TSSOP
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9179
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20-TSSOP (0.173", 4.40mm Width)
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ARM® Cortex®-M0+ Kinetis KE02 Microcontroller IC 32-Bit Single-Core 40MHz 32KB (32K x 8) FLASH 64-LQFP (10x10)
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5444
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64-LQFP
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ARM® Cortex®-M4/M0 LPC43xx Microcontroller IC 32-Bit Dual-Core 204MHz 768KB (768K x 8) FLASH 144-LQFP (20x20)
How do you identify which pin is pin 1 of an IC integrated circuit chip? |ICONECHIPFor more product unboxing videos, please click on the link
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1344
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144-LQFP
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PMIC
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9295
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HC08 HC08 Microcontroller IC 8-Bit 8MHz 48KB (48K x 8) FLASH 48-LQFP (7x7)
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4981
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48-LQFP
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MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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5167
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357-BBGA
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PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29)
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7640
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783-BBGA, FCBGA
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ARM® Cortex®-M0 LPC11Uxx Microcontroller IC 32-Bit Single-Core 50MHz 64KB (64K x 8) FLASH 48-TFBGA (4.5x4.5)
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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7130
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48-TFBGA
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Buffer, ReDriver 2 Channel 5Gbps 12-X2QFN (1.25x2.10)
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7576
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12-XFQFN
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DIRANA3 SINGLE AM FM HIFI
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7120
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Zener Diode 39 V 1.5 W ±5% Surface Mount SOT-223
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7816
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TO-261-4, TO-261AA
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Voltage Level Translator Bidirectional 1 Circuit 2 Channel 420Mbps 8-XSON (1.35x1)
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2
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8-XFDFN
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* Microcontroller IC
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9929
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HC08 HC08 Microcontroller IC 8-Bit 8MHz 48KB (48K x 8) FLASH 64-QFP (14x14)
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3974
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64-QFP
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MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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6365
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357-BBGA
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Automotive Interface 48-QFN-EP (7x7)
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8195
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48-VFQFN Exposed Pad
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ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz ROMless 208-LQFP (28x28)
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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6475
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208-LQFP
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ARM® Cortex®-M3 LPC18xx Microcontroller IC 32-Bit Single-Core 180MHz 1MB (1M x 8) FLASH 144-LQFP (20x20)
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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5820
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144-LQFP
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e200z2, e200z4 MPC57xx Microcontroller IC 32-Bit Dual-Core 80MHz/160MHz 4MB (4M x 8) FLASH 176-LQFP (24x24)
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5015
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176-LQFP Exposed Pad
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Zener Diode 4.3 V 1 W ±5% Surface Mount SOT-89
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3645
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TO-243AA
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Buffer, Inverting 2 Element 4 Bit per Element 3-State Output 20-TSSOP
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6872
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20-TSSOP (0.173", 4.40mm Width)
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HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 128KB (128K x 8) FLASH 112-LQFP (20x20) Overview Device Introduction Freescale Semiconductor’s MC9S12A128 Flash microcontroller (MCU) is the next generation of the highly successful 68HC12 architecture. Using Freescale’s industry-leading 0.25 µs Flash, the A128 is part of a pin-compatible family that scales from 32 KB to 512 KB of Flash memory. The MC9S12A128 provides an upward migration path from Freescale’s 68HC08, 68HC11 and 68HC12 architectures for applications that need larger memory, more peripherals and higher performance. Device Features High-Performance 16-bit HCS12 CPU Core > 25 MHz bus operation at 5V for 40 ns minimum instruction cycle time > Opcode compatible with the 68HC11 and 68HC12 > C-optimized architecture produces extremely compact code On-Chip Debug Interface > Dedicated serial debug interface > On-chip breakpoints > Real-time in-circuit emulation and debug without expensive and cumbersome box emulators > Read/write memory and registers while running at full speed Integrated Third-Generation Flash Memory > In-application reprogrammable > Self-timed, fast programming • Fast Flash page erase—20 ms (512 bytes) • Can program 16 bits in 20 µs while in burst mode > 5V Flash program/erase/read > Flash granularity—512 byte Flash erase/2 byte Flash program > Two independently programmable Flash arrays > Flexible block protection and security > Flexibility to change code in the field > Efficient end-of-line programming > Total program time for 128 KB code is less than five seconds > Reduces production programming cost through ultra-fast programming > No external high voltage or charge pump required > Virtual EEPROM implementation, Flash array usable for EE extension > Can erase one array while executing code from another 2 KB Integrated EEPROM > Flexible protection scheme for protection against accidental program or erase > EEPROM can be programmed in 46 µs > Can erase 4 bytes at a time and program 2 bytes at a time for calibration, security, personality and diagnostic information 10-bit Analog-to-Digital Converter (ADC) > Two, 8-channel ADCs > 7 µs, 10-bit single conversion time, scan mode available > Fast, easy conversion from analog inputs like position sensors, analog meters and photovoltaic cells to digital values for CPU processing > Can effectively have 3.5 µs conversion time by sampling same signal with both ADCs NXP Electronics components unboxing，humidity card changed color chip can used？ |
9939
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112-LQFP
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Coldfire V2 Microprocessor IC MCF520x 1 Core, 32-Bit 25MHz 160-QFP (28x28)
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5740
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160-BQFP
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RF Mosfet 28 V 850 mA 1.93GHz ~ 1.99GHz 14.5dB 18W NI-780
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1356
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NI-780
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