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Img
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Pdf
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Part Number
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Manufacturers
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Desc
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In Stock
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Packing
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Buffer, Non-Inverting 1 Element 1 Bit per Element 3-State Output 5-TSSOP
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3728
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5-TSSOP, SC-70-5, SOT-353
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* Microcontroller IC
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6271
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8051 89C Microcontroller IC 8-Bit 33MHz 64KB (64K x 8) FLASH 44-PLCC (16.59x16.59)
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9070
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44-LCC (J-Lead)
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IC DSP 24BIT 150MHZ 52-LQFP
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7440
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52-LQFP
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ARM9® LPC2900 Microcontroller IC 16/32-Bit 80MHz 512KB (512K x 8) FLASH 144-LQFP (20x20)
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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5266
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144-LQFP
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PowerPC e500v2 Microprocessor IC QorIQ P1 1 Core, 32-Bit 667MHz 561-TEPBGA I (23x23)
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2552
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561-FBGA
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ARM® Cortex®-M3 LPC15xx Microcontroller IC 32-Bit Single-Core 72MHz 128KB (128K x 8) FLASH 100-LQFP (14x14)
What are the most common mistakes made when sourcing electronic component? | ICONECHIPFor more product unboxing videos, please click on the link
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6525
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100-LQFP
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HCS12 HCS12 Microcontroller IC 16-Bit 32MHz 64KB (64K x 8) FLASH 64-LQFP (10x10)
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9518
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64-LQFP
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OR Gate IC 4 Channel 14-TSSOP
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57
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14-TSSOP (0.173", 4.40mm Width)
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Zener Diode
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32
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PMIC
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4626
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XA XA Microcontroller IC 16-Bit 30MHz ROMless 44-LQFP (10x10)
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7449
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44-LQFP
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CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32)
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9873
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240-BFQFP
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AUDIO PROCESSOR SYMPH 144-LQFP
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5396
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144-LQFP
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PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 800MHz 689-TEPBGA II (31x31)
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1066
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689-BBGA Exposed Pad
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Power Switch/Driver 1:1 N-Channel 2.5A 6-WLCSP (0.87x1.37)
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3937
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6-UFBGA, WLCSP
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12V1 S12 MagniV Microcontroller IC 16-Bit 25MHz 48KB (48K x 8) FLASH 48-LQFP (7x7)
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8383
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48-LQFP
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XOR (Exclusive OR) IC 2 Channel 8-VSSOP
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9671
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8-VFSOP (0.091", 2.30mm Width)
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ARM® Cortex®-M4 Kinetis K60 Microcontroller IC 32-Bit Single-Core 100MHz 256KB (256K x 8) FLASH 144-LQFP (20x20)
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8411
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144-LQFP
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* Microcontroller IC
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1821
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Diode 100 V 200mA Through Hole ALF2
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9996
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DO-204AH, DO-35, Axial
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PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.167GHZ 360-FCCBGA (25x25)
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2099
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360-BCBGA, FCCBGA
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PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)
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3525
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256-BBGA
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PowerPC e500v2 Microprocessor IC QorIQ P1 2 Core, 32-Bit 800MHz 689-TEPBGA II (31x31)
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2273
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689-BBGA Exposed Pad
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ARM® Cortex®-M0 LPC1100XL Microcontroller IC 32-Bit Single-Core 50MHz 16KB (16K x 8) FLASH 32-HVQFN (5x5)
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6899
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32-VFQFN Exposed Pad
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IC MCU 16 位 128KB 闪存 80QFP
-原创内容,请勿转载。
今天我们要开箱汽车芯片 在这个长方形的纸箱前面,是熟悉的芯片包装盒
芯片的盒子表面有品牌标志,这个盒子上印有 NXP 的标志
在芯片标签信息旁边,具体信息我们后面再说
Let's look at the small box icon. next to the triangle with a hand pattern is the circuit board anti-static label
next to the triangle with a hand pattern is the circuit board anti-static label
The side one also has three small icons
The pattern of the cup represents fragile items, take it lightly
Umbrella-shaped pattern, refers to can not be caught by water, afraid of moisture
The arrow refers to the side to swing up
Cut the tape at the seal with the knife and open the carton
The foam board above is used to protect the chip and is a bodyguard
The vacuum electrostatic bag is also one of the bodyguards of the chip, and the chip is hidden inside
The chip is more protective in the tights, so the vacuum is very important
Next, let's talk about the tag information mentioned earlier First, the brand: NXP
Below it is the lot encoding
date of manufacture
quantity
product model
product code
The msl, abbreviated for Moisture Sensitivity Level, means moisture sensitivity grade
3 is to show that this material is less than or equal to 30°C / 60% RH 168 hours workshop life
The small circle of PB is illustrated as a lead-free device,Compliance with the EU RoHS specification,Comply with the ROHS3 specification
Cut open the vacuum bag and remove the chip
The chip holds a black anti-static tray, with desiccant and 3 points outside the humidity indicator card
The humidity card is blue, indicating that there is no damp, and the humidity card will become pink.
If the chip is opened, it can be put in the drying cabinet together with the humidity card, and then stored in vacuum.
Cut off the black braid band and open the tray cover
The chip is new without scratches, bright feet, looks very complete,The chip is particularly fragile, and the pin is easy to be damaged, especially the QFP pin is too much, so we should pay special attention to it
We use the suction pen to take the chip, remember to suck it firmly and then pick it up
The size of the chip is 14 mm x 14 mm, and the thickness of the chip is 2. 3 mm
Each chip weighs at 935. 5 (mg)Can you call it the actual shoot?
There is a spacing of 0.65 mm between each pin
The screen print on the chip is Freescale's logo
Here, although Freescale was acquired by nxp, because the chip is 9S12 series, its predecessor is FREESCALE, so the brand logo on the carton and the label are NXP, while the LOGO screen of the chip is still in FREESCALE
In addition, the model
Many friends are curious to say that they bought S9S12 but the chip screen is MC9S12, whether they buy fake goods, it is not so, this is a normal situation
What is the difference between S9S12 and MC9S12, we will expand to tell you later.
The origin of the chip is printed on the back of the circle, which is made in Malaysia
At the same time, from the seagull wing (L) type pin can be seen, is QFP packaging, this knowledge point in the previous QFP chip packaging physical explanation of the video mentioned ~ chip packaging confused friends, you can go to the home page to view oh ~
MCU chip If you need this NXP MCU chip, you can contact us, and other models you want to see the chip can be left in the comments section
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1680
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80-QFP
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$8.77
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Flip Flop 2 Element D-Type 1 Bit Positive Edge 14-SOIC (0.154", 3.90mm Width)
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15
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14-SOIC (0.154", 3.90mm Width)
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Buffer, Inverting 2 Element 1 Bit per Element 3-State Output 8-XSON (1.95x1)
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85
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8-XFDFN
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* Microcontroller IC
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5943
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Decoder/Demultiplexer 1 x 3:8 16-DIP
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2283
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16-DIP (0.300", 7.62mm)
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