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Pdf
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Part Number
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Manufacturers
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Desc
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In Stock
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Shift Register, Multiplexed 4 Element 64 Bit 16-DIP
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3753
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16-DIP (0.300", 7.62mm)
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S08 S08 Microcontroller IC 8-Bit 40MHz 60KB (60K x 8) FLASH 42-PDIP
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1449
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42-SDIP (0.600", 15.24mm)
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S08 S08 Microcontroller IC 8-Bit 40MHz 4KB (4K x 8) FLASH 20-TSSOP
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15
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20-TSSOP (0.173", 4.40mm Width)
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Linear Voltage Regulator IC Positive Fixed 1 Output 150mA 5-TSOP
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4370
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SC-74A, SOT-753
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Secure MX51 SmartMX Microcontroller IC 32-Bit Single-Core 30MHz 200KB (200K x 8) ROM
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5711
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Amplifier IC 4-Channel (Quad) Class AB DBS27P
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6614
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27-SIP, Formed Leads
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Microprocessor IC *
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3
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SMPS CONTROL IC
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1936
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S12Z S12 MagniV Microcontroller IC 16-Bit 32MHz 64KB (64K x 8) FLASH 48-LQFP (7x7) Introduction The MC9S12ZVL-Family is an automotive 16-bit microcontroller family using the180nm NVM+UHV technology that offers the capability to integrate 40V analog components. This family reuses many features from the existing S12 portfolio. The particular differentiating features of this family are the enhanced S12Z core and the integration of “high-voltage”analog modules, including the voltage regulator (VREG) and a Local Interconnect Network (LIN) physical layer. The MC9S12ZVL-Family includes error correction code (ECC) on RAM, FLASH and EEPROM for diagnostic or data storage, a fast analog-to-digital converter (ADC) and a frequency modulated phase locked loop (IPLL) that improves the EMC performance. The MC9S12ZVL-Family delivers an optimized solution with the integration of several key system components into a single device, optimizing system architecture and achieving significant space savings. TheMC9S12ZVL-Family delivers all the advantages and efficiencies of a 16-bit MCU while retaining the low cost, power consumption, EMC, and code-size efficieney advantages currently enjoyed by users of existing S12 families. The MC9S12ZVL-Family is available in 48-pin, 32-pin LQFP and 32-pin QFN-EP. In addition to the I/O ports available in each module, further I/O ports are available with interrupt capability allowing wake-up from stop or wait modes. The MC9S12ZVL-Family is a general-purpose family of devices suitable for a wide range of applications. The MC9S12ZVL-Family is targeted at generic automotive applications requiring LIN connectivity. Typical examples of these applications include switch panels and body endpoints for sensors. Chip-Level Features On-chip modules available within the family include the following features: ·S12Z CPU core ·128, 96, 64, 32, 16 or 8 KB on-chip flash with ECC ·2048,1024,128 byte EEPROM with ECC ·8192,4096, 1024 or 512 byte on-chip SRAM with ECC ·Phase locked loop (IPLL) frequency multiplier with internal filter ·1 MHz internal RC oscillator with +/-1.3% accuracy over rated temperature range ·4-20MHz amplitude controlled pierce oscillator ·Internal COP (watchdog) module ·analog-to-digital converter (ADC) with 10-bit or 12-bit resolution and up to 10 channels available on external pins and Vbg (bandgap) result reference ·PGA module with two input channels ·One 8-bit 5V digital-to-analog converter (DAC) ·One analog comparators (ACMP) with rail-to-rail inputs ·MSCAN(1Mbit/s, CAN2.0 A, B software compatible) module ·One serial peripheral interface (SPI) module ·One serial communication interface (SCI) module with interface to internal LIN physical layer transceiver (with RX connected to a timer channel for frequency calibration purposes, if desired) ·Up to one additional SCI (not connected to LIN physical layer) ·One on-chip LIN physical layer transceiver fully compliant with the LIN 2.2 standard ·6-channel timer module (TIM0) with input capture/output compare ·2-channel timer module (TIM1) with input capture/output compare ·Inter-IC (IIC) module ·8-channel Pulse Width Modulation module (PWM) ·On-chip voltage regulator (VREG) for regulation of input supply and all internal voltages ·Autonomous periodic interrupt (API), supports cyclic wakeup from Stop mode ·Pins to support 25mA drive strength to VSSX ·Pin to support 20mA drive strength from VDDX (EVDD) ·High Voltage Input (HVI) ·Supply voltage sense with low battery warning ·On-chip temperature sensor, temperature value can be measured with ADC or can generate a high temperature warning · Up to 23 pins can be used as keyboard wake-up interrupt (KWI) |
4486
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48-LQFP
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Shift Shift Register 2 Element 4 Bit 16-DIP
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3360
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16-DIP (0.300", 7.62mm)
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S08 S08 Microcontroller IC 8-Bit 40MHz 8KB (8K x 8) FLASH 48-QFN-EP (7x7)
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12
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48-VFQFN Exposed Pad
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S08 S08 Microcontroller IC 8-Bit 40MHz 32KB (32K x 8) FLASH 16-TSSOP
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8766
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16-TSSOP (0.173", 4.40mm Width)
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Linear Voltage Regulator IC Positive Fixed 1 Output 300mA 5-TSOP
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8911
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SC-74A, SOT-753
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* Microcontroller IC
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4795
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Embedded Systems, Low-Power IoT, Mobile/Wearable Devices PMIC 40-HVQFN (5x5)
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9924
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40-VFQFN Exposed Pad
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4 X 44 AUTOMOTIVE LCD DRIVER
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3526
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LOW-VOLTAGE 8-BIT I2C-BUS AND SM
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9451
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HCS12X HCS12X Microcontroller IC 16-Bit 50MHz 1MB (1M x 8) FLASH 208-BGA (17x17) Introduction The MC9S12XE-Family of micro controllers is a further development of the S12XD-Family including new features for enhanced system integrity and greater functionality. These new features include a Memory Protection Unit (MPU) and Error Correction Code (ECC) on the Flash memory together with enhanced EEPROM functionality (EEE), an enhanced XGATE, an Internally filtered, frequency modulated Phase Locked Loop (IPLL) and an enhanced ATD. The E-Family extends the S12X product range up to 1MB of Flash memory with increased I/O capability in the 208-pin version of the flagship MC9S12XE100. The MC9S12XE-Family delivers 32-bit performance with all the advantages and efficiencies of a 16 bit MCU. It retains the low cost, power consumption, EMC and code-size efficiency advantages currently enjoyed by users of Freescale’s existing 16-Bit MC9S12 and S12X MCU families. There is a high level of compatibility between the S12XE and S12XD families. The MC9S12XE-Family features an enhanced version of the performance-boosting XGATE co-processor which is programmable in “C” language and runs at twice the bus frequency of the S12X with an instruction set optimized for data movement, logic and bit manipulation instructions and which can service any peripheral module on the device. The new enhanced version has improved interrupt handling capability and is fully compatible with the existing XGATE module. The MC9S12XE-Family is composed of standard on-chip peripherals including up to 64Kbytes of RAM, eight asynchronous serial communications interfaces (SCI), three serial peripheral interfaces (SPI), an 8- channel IC/OC enhanced capture timer (ECT), two 16-channel, 12-bit analog-to-digital converters, an 8- channel pulse-width modulator (PWM), five CAN 2.0 A, B software compatible modules (MSCAN12), two inter-IC bus blocks (IIC), an 8-channel 24-bit periodic interrupt timer (PIT) and an 8-channel 16-bit standard timer module (TIM). The MC9S12XE-Family uses 16-bit wide accesses without wait states for all peripherals and memories. The non-multiplexed expanded bus interface available on the 144/208-Pin versions allows an easy interface to external memories. In addition to the I/O ports available in each module, up to 26 further I/O ports are available with interrupt capability allowing Wake-Up from STOP or WAIT modes. The MC9S12XE-Family is available in 208- Pin MAPBGA, 144-Pin LQFP, 112-Pin LQFP or 80-Pin QFP options. Features • 16-Bit CPU12X — Upward compatible with MC9S12 instruction set with the exception of five Fuzzy instructions (MEM, WAV, WAVR, REV, REVW) which have been removed — Enhanced indexed addressing — Access to large data segments independent of PPAGE • INT (interrupt module) — Eight levels of nested interrupts — Flexible assignment of interrupt sources to each interrupt level. — External non-maskable high priority interrupt (XIRQ) — Internal non-maskable high priority Memory Protection Unit interrupt — Up to 24 pins on ports J, H and P configurable as rising or falling edge sensitive interrupts • EBI (external bus interface)(available in 208-Pin and 144-Pin packages only) — Up to four chip select outputs to select 16K, 1M, 2M and up to 4MByte address spaces — Each chip select output can be configured to complete transaction on either the time-out of one of the two wait state generators or the deassertion of EWAIT signal • MMC (module mapping control) • DBG (debug module) — Monitoring of CPU and/or XGATE busses with tag-type or force-type breakpoint requests — 64 x 64-bit circular trace buffer captures change-of-flow or memory access information • BDM (background debug mode) • MPU (memory protection unit) — 8 address regions definable per active program task — Address range granularity as low as 8-bytes — No write / No execute Protection Attributes — Non-maskable interrupt on access violation • XGATE — Programmable, high performance I/O coprocessor module — Transfers data to or from all peripherals and RAM without CPU intervention or CPU wait states — Performs logical, shifts, arithmetic, and bit operations on data — Can interrupt the HCS12X CPU signalling transfer completion — Triggers from any hardware module as well as from the CPU possible — Two interrupt levels to service high priority tasks — Hardware support for stack pointer initialisation • OSC_LCP (oscillator) — Low power loop control Pierce oscillator utilizing a 4MHz to 16MHz crystal — Good noise immunity — Full-swing Pierce option utilizing a 2MHz to 40MHz crystal — Transconductance sized for optimum start-up margin for typical crystals • IPLL (Internally filtered, frequency modulated phase-locked-loop clock generation) — No external components required — Configurable option to spread spectrum for reduced EMC radiation (frequency modulation) • CRG (clock and reset generation) — COP watchdog — Real time interrupt — Clock monitor — Fast wake up from STOP in self clock mode • Memory Options — 128K, 256k, 384K, 512K, 768K and 1M byte Flash — 2K, 4K byte emulated EEPROM — 12K, 16K, 24K, 32K, 48K and 64K Byte RAM • Flash General Features — 64 data bits plus 8 syndrome ECC (Error Correction Code) bits allow single bit failure correction and double fault detection — Erase sector size 1024 bytes — Automated program and erase algorithm • D-Flash Features — Up to 32 Kbytes of D-Flash memory with 256 byte sectors for user access. — Dedicated commands to control access to the D-Flash memory over EEE operation. — Single bit fault correction and double bit fault detection within a word during read operations. — Automated program and erase algorithm with verify and generation of ECC parity bits. — Fast sector erase and word program operation. — Ability to program up to four words in a burst sequence • Emulated EEPROM Features — Automatic EEE file handling using an internal Memory Controller. — Automatic transfer of valid EEE data from D-Flash memory to buffer RAM on reset. — Ability to monitor the number of outstanding EEE related buffer RAM words left to be programmed into D-Flash memory. — Ability to disable EEE operation and allow priority access to the D-Flash memory. — Ability to cancel all pending EEE operations and allow priority access to the D-Flash memory. • Two 16-channel, 12-bit Analog-to-Digital Converters — 8/10/12 Bit resolution — 3µs, 10-bit single conversion time — Left/right, signed/unsigned result data — External and internal conversion trigger capability — Internal oscillator for conversion in Stop modes — Wake from low power modes on analog comparison > or <= match • Five MSCAN (1 M bit per second, CAN 2.0 A, B software compatible modules) — Five receive and three transmit buffers — Flexible identifier filter programmable as 2 x 32 bit, 4 x 16 bit, or 8 x 8 bit — Four separate interrupt channels for Rx, Tx, error, and wake-up — Low-pass filter wake-up function — Loop-back for self-test operation • ECT (enhanced capture timer) — 8 x 16-bit channels for input capture or output compare — 16-bit free-running counter with 8-bit precision prescaler — 16-bit modulus down counter with 8-bit precision prescaler — Four 8-bit or two 16-bit pulse accumulators • TIM (standard timer module) — 8 x 16-bit channels for input capture or output compare — 16-bit free-running counter with 8-bit precision prescaler — 1 x 16-bit pulse accumulator • PIT (periodic interrupt timer) — Up to eight timers with independent time-out periods — Time-out periods selectable between 1 and 224 bus clock cycles — Time-out interrupt and peripheral triggers • 8 PWM (pulse-width modulator) channels — 8 channel x 8-bit or 4 channel x 16-bit Pulse Width Modulator — programmable period and duty cycle per channel — Center- or left-aligned outputs — Programmable clock select logic with a wide range of frequencies — Fast emergency shutdown input • Three Serial Peripheral Interface Modules (SPI) — Configurable for 8 or 16-bit data size • Eight Serial Communication Interfaces (SCI) — Standard mark/space non-return-to-zero (NRZ) format — Selectable IrDA 1.4 return-to-zero-inverted (RZI) format with programmable pulse widths • Two Inter-IC bus (IIC) Modules — Multi-master operation — Software programmable for one of 256 different serial clock frequencies — Broadcast mode support — 10-bit address support • On-Chip Voltage Regulator — Two parallel, linear voltage regulators with bandgap reference — Low-voltage detect (LVD) with low-voltage interrupt (LVI) — Power-on reset (POR) circuit — 3.3V and 5V range operation — Low-voltage reset (LVR) • Low-power wake-up timer (API) — Available in all modes including Full Stop Mode — Trimmable to +-5% accuracy — Time-out periods range from 0.2ms to ~13s with a 0.2ms resolution • Input/Output — Up to 152 general-purpose input/output (I/O) pins plus 2 input-only pins — Hysteresis and configurable pull up/pull down device on all input pins — Configurable drive strength on all output pins • Package Options — 208-pin MAPBGA — 144-pin low-profile quad flat-pack (LQFP) — 112-pin low-profile quad flat-pack (LQFP) — 80-pin quad flat-pack (QFP) • 50MHz maximum CPU bus frequency, 100MHz maximum XGATE bus frequency |
8147
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208-BGA
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Asynchronous, Synchronous FIFO 576 (64 x 9) Uni-Directional 29MHz 40ns 28-DIP
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4986
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28-DIP (0.600", 15.24mm)
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ARM7® LPC2100 Microcontroller IC 16/32-Bit 60MHz 128KB (128K x 8) FLASH 64-LQFP (10x10)
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3907
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64-LQFP
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S08 S08 Microcontroller IC 8-Bit 40MHz 4KB (4K x 8) FLASH 20-SOIC
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4914
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20-SOIC (0.295", 7.50mm Width)
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ARM® Cortex®-M0 LPC1104 Microcontroller IC 32-Bit Single-Core 50MHz 32KB (32K x 8) FLASH 16-WLCSP (2.17x2.32)
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7992
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16-UFBGA, WLCSP
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* Microcontroller IC
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1729
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Embedded Systems, Low-Power IoT, Mobile/Wearable Devices PMIC 40-HVQFN (5x5)
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4600
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40-VFQFN Exposed Pad
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D-Type Transparent Latch 2 Channel 8:8 IC Tri-State, Non-Inverted 48-SSOP
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1
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48-BSSOP (0.295", 7.50mm Width)
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Bipolar (BJT) Transistor Array
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8256
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Buffer, Non-Inverting 4 Element 1 Bit per Element 3-State Output 14-DIP
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2894
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14-DIP (0.300", 7.62mm)
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Diode Array 1 Pair Common Anode 30 V 200mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3
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5318
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TO-236-3, SC-59, SOT-23-3
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HCS12 HCS12 Microcontroller IC 16-Bit 32MHz 96KB (96K x 8) FLASH 48-QFN-EP (7x7)
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5537
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48-TFQFN Exposed Pad
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ARM® Cortex®-M4 LPC40xx Microcontroller IC 32-Bit Single-Core 120MHz 128KB (128K x 8) FLASH 80-LQFP (12x12)
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1208
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80-LQFP
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