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Part Number
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Manufacturers
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Desc
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In Stock
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Packing
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Buffer, Non-Inverting 6 Element 1 Bit per Element Open Collector Output 14-SO
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9444
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14-SOIC (0.154", 3.90mm Width)
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PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)
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2934
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783-BBGA, FCBGA
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HCS12X HCS12X Microcontroller IC 16-Bit 50MHz 768KB (768K x 8) FLASH 144-LQFP (20x20)
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7378
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144-LQFP
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1/1 Transceiver Half LINbus 8-SO
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4704
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8-SOIC (0.154", 3.90mm Width)
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DisplayPort, PCIe, Video Switch IC 6 Channel 50-TFBGA (5x5)
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5032
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50-TFBGA
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e200z0h MPC56xx Qorivva Microcontroller IC 32-Bit Single-Core 64MHz 256KB (256K x 8) FLASH 64-LQFP (10x10)
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3473
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64-LQFP
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Shift Element Bit
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15
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HYBRID (ANALOG AND DIGITAL) SILI
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6750
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XA XA Microcontroller IC 16-Bit 32MHz 32KB (32K x 8) OTP 44-LQFP (10x10) GENERAL DESCRIPTION The XA–C3 is a member of the Philips XA (eXtended Architecture) family of high–performance 16–bit single–chip microcontrollers. The XA–C3 combines an array of standard peripherals together with a PeliCAN CAN 2.0B engine and unique ”Message Management” hardware to provide integrated support for most CAN Transport Layer (CTL) protocols such as DeviceNet, CANopen and OSEK. For additional details, refer to the XA-C3 Overview on page 35. The XA architecture supports: •Easy 16-bit migration from the 80C51 architecture. •16–bit fully static CPU with 24–bit addressed PROGRAM and DATA spaces. •Twenty–one 16–bit CPU core registers capable of all arithmetic and logic operations while serving as memory pointers. •An enhanced orthogonal instruction set tailored for high–level support of the C language. •Multi–tasking and direct real–time executive support. •Low–power operation intrinsic to the XA architecture includes Power–Down and Idle modes. FEATURES IN COMMON WITH XA-G3 •Pin–compatibility (CAN RxD and CAN TxD use the XA-G3 NC pins). •32K bytes of on–chip EPROM PROGRAM memory (see Table 1). •44–pin PLCC (Figure 1 and Table 2) and 44–pin LQFP (Figure 2 and Table 3) packages. •Commercial (0 to 70oC) and Industrial (–40 to 85oC) ranges. •Supports off–chip addressing of PROGRAM and DATA memory up to 1 megabyte each (20 address lines). •Three standard counter/timers (T0, T1, and T2) with enhancements such as Auto Reload for PWM outputs. •UART–0 with enhancements such as separate Rx and Tx interrupts, Break Detection, and Automatic Address Recognition. •Watchdog with a secure WFEED1 / WFEED2 sequence. •Four 8–bit I/O ports with 4 programmable output configurations per pin. XA-C3 SPECIFIC FEATURES •32 MHz operating frequency at 4.5 to 5.5V operation. •One Serial Port Interface (SPI) •1024 bytes of on–chip DATA RAM. •42 vectored interrupts. These include 13 maskable Events, 7 Software interrupts, 6 Exceptions, 16 software Traps, segmented DATA memory, multiple User stacks, and banked registers to support rapid context switching. •External interfacing via a 16–bit DATA bus width. XA-C3 CAN AND CTL FEATURES •A PeliCAN CAN 2.0B engine from the SJA1000 Stand–alone CAN controller which supports 11– and 29–bit IDentifiers and the maximum CAN data rate (1 Mbps) and CAN Diagnostics. •Hardware “Message Management” support for all major CTL protocols: DeviceNet, CANopen, OSEK. •Automatic (hardware) assembly of Fragmented Messages via a Transport Layer Co-Processor. Concurrent assembly of up to 32 separate interleaved Fragmented Messages •32 CAN Transport Layer (CTL) Message Objects are modelled as a FullCAN Object Superset. •32 separate filters/screeners (one per Message Object), each allowing a 30–bit ID Match and full 29–bit Mask (i.e., each filter/screener represents a unique Group address). •Each Message Object can be configured as Receive or Transmit. •A separate message buffer is associated with each CTL Message Object. 32 message buffers are located in XRAM and managed by 32 DMA channels. Message buffer size for each Message Object is independently configurable in length (from 2 to 256 bytes). •For single–chip systems there is a 512–byte (on–chip) XRAM message buffer, independent of the 1K on–chip DATA RAM, which is extendable (off–chip) to 8K bytes (i.e., 32 Message Objects that can be up to 256 bytes each). |
9561
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44-LQFP
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Buffer, ReDriver 2 Channel 400kHz 8-TSSOP
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9
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8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
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PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29)
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5676
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783-BFBGA, FCBGA
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Coldfire V2 MCF5221x Microcontroller IC 32-Bit Single-Core 50MHz 64KB (64K x 8) FLASH 64-LQFP (10x10)
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691
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64-LQFP
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RF Transistor NPN 2.8V 30mA 55GHz 197mW Surface Mount 4-DFP
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89
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SOT-343F
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ARM® Cortex®-M4/M0 LPC43xx Microcontroller IC 32-Bit Dual-Core 204MHz ROMless 144-LQFP (20x20)
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9950
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144-LQFP
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e200z0h MPC56xx Qorivva Microcontroller IC 32-Bit Single-Core 64MHz 384KB (384K x 8) FLASH 64-LQFP (10x10)
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7614
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64-LQFP
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IC Channel
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7
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Bipolar (BJT) Transistor PNP 60 V 1 A 145MHz 420 mW Surface Mount 3-HUSON (2x2)
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4311
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3-PowerUDFN
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2-Channel I²C Multiplexer Interface 16-HVQFN (4x4)
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8544
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16-VQFN Exposed Pad
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MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
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4927
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357-BBGA
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Coldfire V4 MCF5445x Microcontroller IC 32-Bit Single-Core 266MHz ROMless 360-TEPBGA (23x23)
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6280
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360-BBGA
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Video Tuner IC I²C 40-HVQFN (6x6) Package
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6006
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40-VFQFN Exposed Pad
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LCD Driver 56-VSO
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1
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56-BSOP (0.435", 11.05mm Width)
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e200z0h MPC56xx Qorivva Microcontroller IC 32-Bit Single-Core 48MHz 384KB (384K x 8) FLASH 100-LQFP (14x14)
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4263
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100-LQFP
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Bus Switch 10 x 1:1 48-SSOP
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1429
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48-BSSOP (0.295", 7.50mm Width)
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Zener Diode 20 V 320 mW ±2% Surface Mount SOD-323
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9555
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SC-76, SOD-323
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Translating Switch Interface 20-TSSOP
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1583
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20-TSSOP (0.173", 4.40mm Width)
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MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)
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8303
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357-BBGA
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ARM1136JF-S Microprocessor IC i.MX31 1 Core, 32-Bit 400MHz 473-LFBGA (19x19)
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2493
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473-LFBGA
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Video Switch IC I²C CEA-861-D, DVI 1.0, HDCP 1.4, HDMI 1.4a 100-LQFP (14x14) Package
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3811
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100-LQFP
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Converter Offline Flyback Topology 65kHz SC-74
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9079
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SC-74, SOT-457
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